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Henkel Corporation
The electronics group of HENKEL provides materials solutions for the electronics industry. Our breadth of technology includes encapsulants, underfills, molding compounds, coating powders, electrically conductive adhesives, die attach adhesives, solder and flux materials, surface mount adhesives, conformal coatings, potting compounds, thermally conductive materials, phase change thermal interface materials, and optoelectronic materials.

Achieving Thermal Control for Power Devices Die Attach Solder Paste Takes the Heat (02/01/2008)

Stuck Using a Tacky Flux that’s Less than Ideal? New Technology Delivers Robust Materials for Many Applications (11/19/2007)

The Total Package: Next-Generation Tacky Flux and Solder Spheres (12/13/2007)

View all White Papers from Henkel Corporation

 

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Master Bond, Inc.,
Master Bond Inc. manufactures a complete line of specialty formulated adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. Our line of products consists of epoxies, polyurethanes, silicones, acrylics, polyamides and latex systems. They also include such specialties as anaerobics and cyanoacrylates. One and two component systems are available. Systems cure at room temperature, exposure to heat and upon exposure to UV/Visible light.

We offer over 3,000 grades of specially designed formulations. They vary in viscosity, cure speeds, temperature resistance, chemical resistance, physical strength properties, electrical properties, colors etc. If a product is not available to meet your requirements, Master Bond will custom formulate one to meet your exact needs. This may include the redesign of an existing product or the development of a new composition.

Master Bond products are successfully employed in industries ranging from aerospace, automotive, electronic, medical, optical, oil/chemical processing etc. They offer the highest level of reliability and performance essential for the many different operating conditions encountered in use. Our formulations are based on the latest technological advances and are made to the strictest quality control standards. Additionally special grades have NASA, UL, Mil spec and USP Class VI approval.

Master Bond compounds are available in both large and small quantities. Our range of packaging solutions are designed to reduce waste. They are commonly used in applications ranging from design, production to maintenance, repair and field service. Standard packaging consists of cans, bottles, jars, pails and drums. Common sizes include half pint, pint, quart, gallon, five gallon and drum units. Additionally, other types of packaging available include single and double barrel syringes, cartridges, flexible divider pouches and pre-mixed and frozen syringes.

Master Bond offers individualized, personal one on one service. Our highly trained staff of technical experts have years of experience in meeting the specific needs of our customers. If needed, our engineering staff can recommend and select the preferred formulation tailor made to meet your application needs.

Newly Developed High Performance Epoxy Adhesives Revolutionize Structural Bonding (07/01/2005)

View all White Papers from Master Bond, Inc.,

 

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Recently Added White Papers

Die Attach Film Technologies for Next-Generation Devices (03/04/2008, Henkel Corporation)

Achieving Thermal Control for Power Devices Die Attach Solder Paste Takes the Heat (02/01/2008, Henkel Corporation)

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Featured White Papers

Die Attach Film Technologies for Next-Generation Devices (03/04/2008)
 

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