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Die Attach Film Technologies for Next-Generation Devices Ongoing device miniaturization – the drive to push more functionality into smaller and smaller footprints -- continues to challenge ... (03/04/2008, Henkel Corporation)

Recently Added White Papers

Die Attach Film Technologies for Next-Generation Devices
Ongoing device miniaturization – the drive to push more functionality into smaller and smaller footprints -- continues to challenge even the most advanced package developers.
(03/04/2008, Henkel Corporation)

Achieving Thermal Control for Power Devices Die Attach Solder Paste Takes the Heat
Not only are today's package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints and higher I/O counts, but ...
(02/01/2008, Henkel Corporation)

The Total Package: Next-Generation Tacky Flux and Solder Spheres
...
(12/13/2007, Henkel Corporation)

Stuck Using a Tacky Flux that’s Less than Ideal? New Technology Delivers Robust Materials for Many Applications
With so much emphasis and coverage as of late on optimum solder paste formulations, die attach advances and underfill developments, often a critical material for package and board ...
(11/19/2007, Henkel Corporation)

Developing Die Attach Materials with Proven Performance
Designing die attach materials for today’s demanding packaging applications takes more than formulators and analytical equipment.
(07/12/2007, Henkel Corporation)

Newly Developed High Performance Epoxy Adhesives Revolutionize Structural Bonding
Newly developed high performance epoxy adhesive systems offer an increasingly technical and economic advantage over traditional mechanical fasteners for even the most demanding load ...
(07/01/2005, Master Bond, Inc.,)

Webcasts Advances in 3D Packaging: Focus on Lithography Original broadcast on April 30, 2008 Sockets that Meet Today's Needs Original broadcast on March 25, 2008 3D Packaging - Part III: Reliability, Test & Inspection Original broadcast on January 17, 2008 Sponsored White Papers Library Recently Added White Papers Die Attach Film Technologies for Next-Generation Devices (03/04/2008, Henkel Corporation) Achieving Thermal Control for Power Devices Die Attach Solder Paste Takes the Heat (02/01/2008, Henkel Corporation) Featured White Papers Die Attach Film Technologies for Next-Generation Devices (03/04/2008)