Trends in Wafer Bonding for MEMS and 3D Integration

Originally Broadcast: September 18, 2008
Overview:
The wafer-level capping of fragile MEMS structures (e.g. for accelerometer, gyroscopes and pressure sensors) for protection and sealing purposes with wafer bonding is quickly displacing chip-scale packages. Especially for novel consumer MEMS applications (see the Apple iPhone or the Nintendo Wii) that have to keep record-small form factors, wafer bonding is a major contributor to reduce ...