Lee Smith, Senior Director at Amkor and industry expert in 3-D packaging talks about the latest package styles.; Gail Flower; Lee Smith; Advanced Packaging; AmKor; Confab; Steve Dwyer, VP and General Manager America, talks about EVG’s greatest strengths as a company.; Gail Flower; EVG; Advanced Packaging; Confab; Steve Dwyer; Sitaram Arkalgud, PhD, Director, Interconnect Division, talks about SEMATECH's emphasis on new technologies.; Gail Flower; Advanced Packaging; Confab; Sitaram Arkalgud; At SEMICON China, Kulicke & Soffa Industries, Inc. launched two next-generation wire bonders, IConn and ConnX;