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From the Editor
More Functionality in One Editor
I guess it's time to put my money where my mouth is. I've been spouting off for months about how important it is for everyone in the semiconductor and electronics industries to learn about technologies across the supply chain. As associate and then managing editor of Advanced Packaging magazine, I've been immersed in back-of-the-line technologies, while only dabbling in the front-end and board assembly where the technologies overlap.
2008 Advanced Packaging Awards |  | |
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Current Issues, Newsletters and Resource Guides | | |
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From The Wires | | |
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The Riley Report
Evolving Technologies
By George A. Riley, contributing editor
The Evolving Technologies Summit at this week's SMTA International, in Orlando, FL, offers a stimulating and sobering example of ...
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Protecting Brand Reputation
By Carsten Barth, Elcoteq
At this time of economic downturn and with reduced consumer confidence, the equity of a brand can be one critical factor in ensuring that sales and margins are maintained while ...
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Executive Viewpoint
Shrink the iPhone
By Jim Stratigos, Jacket Micro Devices
Apple's recently introduced 3G iPhone is a marvel of engineering from just about any perspective; compact, feature rich, cool touch screen, ...
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MEPTEC and Advanced Packaging Magazine to Hold Packaging Symposium
(AUGUST 12, 2008) SAN JOSE, CA — In recognition of MEPTEC's 30th year, MEPTEC and Advanced Packaging magazine will present Packaging Developments and Innovations: From System Design to Integrated ...
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STMicroelectronics, STATSChip PAC, and Infineon Join Forces in Next-gen WLP Development
(August 7, 2008), GENEVA, SINGAPORE, and NEUBIBERG, Germany — STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG have signed an agreement to jointly develop the next-generation of embedded wafer-level ...
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From the Editor
Shifting Gears
After more than a year of what can only be described as frenzied fascination with the development of TSV processes, there seems to be a sudden shift to other things 3D. For a while, TSV sessions ...
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Embedded Passives in Device Packaging: What is Limiting Widespread Adoption?
By Dirk. M Baars, Rogers Corp.
The expectation that embedded passives technology will be required to meet size, performance and cost requirements of devices has been a driver of R&D activity in many materials ...
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RF Components and Devices in 3D LCP Package
Part 1: Embedded Actives
By Swapan K. Bhattacharya, Chad Patterson, and John Papapolymerou, Georgia Tech
As real estate in electronic packages has been compromised in the Z direction, thin has ...
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Beyond the Bunny: "Printing" Your Way To Battery-free Power
By Arthur L. Chait, EoPlex
Batteries are everywhere, powering everything from laptops to greener vehicles. The first dry-cell batteries were mass-produced in 1896. Today's batteries are vast improvements ...
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Webcasts | |
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Sponsored White Papers Library | | |
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QuickVote | |
Should the back-end-of-the-line be re-named middle-of-the-line?
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Upcoming Events | |
SPIE Photomask Technology 2008
September 5 -10, 2008
Monterey, CA
The annual SPIE/BACUS Symposium is a technical conference and exhibition for the photomask industry. Issues discussed ...
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EOS/ESD Symposium and Exhibits
September 7 -12, 2008
Tucson, AZ
EOS/ESD Symposium and Exhibits
The international technical forum on electrical overstress and electrostatic discharge. ...
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30th ANNUAL EOS/ESD Symoposium
September 7 -12, 2008
Tucson, AZ
The EOS/ESD Symposium consists of tutorials, technical sessions, workshops, and exhibits that are dedicated to ESD ...
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Industry Week at Georgia Tech Microsystems Packaging Research Center
September 15 -19, 2008
Atlanta, GA
Included with the well established programs such as MSDT, TIM, and EMAP, are two new consortia development workshops ...
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Web Exclusives 
