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Mentor Graphics Addresses IC Implementation Challenges
(May 9, 2008) Wilsonville OR — Mentor Graphics Corp. has aligned its integrated circuit (IC) implementation product lines under the design-to-silicon division to better address the design and manufacturing challenges of 45nm and smaller process nodes.
2008 Advanced Packaging Awards |  | |
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Current Issues, Newsletters and Resource Guides | | |
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From The Wires | | |
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Endicott Interconnect Awarded Defense Contract Modification
(May 9, 2008) Endicott, NY — The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $148.6M contract modification for the continuation of the current program to produce ...
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From The Editor
Meetings of the Minds
We learn a lot by observing others and listening to their ideas. It's easy to become myopic when we work alone. When we're required to look beyond the boundaries of our scope of knowledge ...
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SMTA's 3D/SiP Symposium Promotes Industry-wide Collaboration
Last week's 3D/SiP Symposium hosted by SMTA, and co-sponsored by Advanced Packaging magazine, turned out to be an intimate gathering of approximately 55 attendees representing not only the U.S., but Canada, France, ...
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Flip Chip Goes 3D
By Daniel F. Baldwin, Ph.D. and Paul Houston, ENGENT, Inc.
With advances in wafer-thinning technology, 3D packaging now provides a robust platform for achieving high levels of integration, small package ...
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Thoughts on the News
The Return of Vertical Integration
By Jeffrey C. Demmin, contributing editor
Many industries seem to oscillate between focusing on core competencies, and trying to grow businesses by expanding ...
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IEEE International Interconnect Technology Conference Goes 3D
(May 7, 2008) Burlingame, CA — When the IEEE International Interconnect Technology Conference convenes at the Hyatt Regency San Francisco Airport Hotel, Burlingame, CA, June 1-4, the focus will be squarely ...
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Oerlikon Esec Introduces Product Family at SEMICON Singapore
(May 5, 2008) Cham, Switzerland and Singapore — Oerlikon Esec, provider of automated chip assembly equipment and system solutions for the semiconductor industry, formally introduced the introductory platform ...
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Ken Joyce Named President of Amkor Technology
(May 5, 2008) Chandler, AZ — Amkor Technology, Inc. announced that Ken Joyce has been appointed President of the company. Joyce, 61, will also continue as COO and will report to James Kim, Chairman and CEO. ...
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IPC, Jisso Sponsor Advanced Interconnect Seminar
(May 1, 2008) Bannockburn, IL. — IPC — and the Jisso International Council (JIC) are sponsoring a technical seminar, "Implementing Advanced Interconnect Technology Solutions," May 21–22, 2008, in Atlanta. ...
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Webcasts | |
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Sponsored White Papers Library | | |
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QuickVote | |
Which TSV approach will be adopted first by the semiconductor industry, via first or via last?
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Upcoming Events | |
3D Integration and Packaging Roadshow
May 12, 2008
Raleigh, NC
The first of 3 stops on the Technology Roadshow for 3D Integration and Packaging. Featuring Speakers from Micron, Freescale, ...
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International Conference on High Temperature Electronics (HiTEC 2008)
May 12 -15, 2008
Albuquerque, NM
This is the premier event addressing the needs of the high temperature electronics community. Applications for high ...
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HiTEC 2008
May 13 -15, 2008
Albuquerque, NM
International Conference on
High Temperature Electronics
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3D Integration and Packaging Roadshow
May 14, 2008
Dallas, TX
The second of three stops on the Technology Roadshow for 3D Integration and Packaging. Featuring Speakers from Micron, ...
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Web Exclusives 
