Advanced Packaging Magazine highlights IC packaging processes, wafer dicing, die placement and more

Jobs


	Advanced Packaging congratulates the winners of the 2005 AP Awards, which honor product excellence in the field of Semiconductor Packaging. Click below to view the presentation from the AP Awards ceremony, images from the AP Awards ceremony, and an official list of winners.

3-D Packaging Technology - Amkor Technology	Die Attach Equipment & Materials - Hover-Davis Inc.	Dispensing, Encapsulation, Molding, Underfill Equipment & Materials - ASM Technology, LTD.
Environmentally Friendly Materials - Aqueous Technologies, Inc.	Handling Equipment/Fixtures - Hover-Davis, Inc.	Flip Chip Attach Equipment & Materials - Datacon
Novel Package Design - Advanced Interconnect Technologies	Package Design Software & Equipment - CAD Design Software	Quality Assurance/Management Tools - KIC
Reflow Equipment - Tamura H.A. System, Inc.	Reflow Equipment - Pro-Mation, Inc.	Semiconductor Assembly & Test Services (SATS) - Kulicke & Soffa
Specialized Advanced Packaging Equipment & Materials - Tyco Electronics Automation Group	Die Attach Equipment & Materials - Hover-Davis Inc.	Surface Treatment Equipment & Materials - Aqueous Technologies, Inc.
Testing Equipment - Gryphics, Inc.	Thermal Management Technology - Dow Corning	Wafer Dicing/Thinning Equipment - DEK Printing Machines, LTD.
Wafer-Level Packaging Equipment & Materials - Milara, Inc.	Wire Bonding Equipment - ASM Technology, LTD	David Baroch - Publisher, Solid State Technology
Advanced Packaging Awards Winners	Thumbs Up for the Advanced Packaging Awards	Audience
Audience	Audience	Jay Regan - Publisher, Industrial Laser Solutions, Mark Vimimski from KIC, and Kathy Poggi - Media Sales Manager, PennWell Corporation
Audience	Audience	The Advanced Packaging Award

Not Pictured: Flip Chip Attach Equipment & Materials - Datacon

Webcasts

Trends in Wafer Bonding for MEMS and 3D Integration
September 18, 2008

Building Blocks and Roadmaps for 3D Integration
Original broadcast on
June 26, 2008

Advances in 3D Packaging: Focus on Lithography
Original broadcast on
April 30, 2008

Sponsored White Papers Library

Featured White Papers

	We've Got Your Back: New Wafer Backside Coating™ Technology Offers Speed, Throughput and Cost-Effective Advantages over Alternative Materials & Methods (05/30/2008)