Industry Calendar - 2008/2008 Events |  |
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May 18-21
WOCSDICE 2008: 32nd Workshop on Compound Semiconductor Devices and ICs
IMEC
Leuven Belgium
Website: www.wocsdice2008.org
The 2008 WOCSDICE will feature advancements in the areas of III-V compounds and large-area scaling, III-nitride materials, devices and circuits, high-frequency circuits, and optical interconnects.
May 20-21
MEMS Packaging Course
Semitracks, Inc.
Munich Germany
Phone: 505-858-0454
Email: peggy.evans@semitracks.com
Website: www.semitracks.com
This course focuses on design, operation, packaging, and reliability aspects of MEMS technologies, with a particular emphasis on packaging.
May 21-22
Program Development and Assessment on ESD
ESDA
Bloomington, MN United States
Website: www.esda.org/education.html
The Program offers the following class: Developing a program based on ANSI/ESD S20.20
May 21-22
IPC/Jisso Advanced Interconnect Technology Solutions
IPC/Jisso
Atlanta, GA United States
Phone: 1 847-597-2822
Email: MichelleMichelotti@ipc.org
Website: www.ipc.org/JF0508
IPC and the Jisso International Council (JIC) are sponsoring a technical seminar to provide information on the latest trends in interconnection technologies used in electronic products. The seminar will be held in conjunction with the 2nd Jisso International Forum being hosted by Georgia Institute of Technology. Members of JIC, as well as technology leaders from industry will be speaking on environment—friendly manufacturing, three-dimensional integration, interposer substrates, and standards activities.
May 22
6th Annual MEMS Symposium
MEPTEC
San Jose, CA United States
Phone: 650-714-1570
Email: bcooper@meptec.org
Website: www.meptec.org
Titled “MEMS Market Evolution: From Technology Push to Market Pull,
May 22
MEMS Market Evolution: From Technology Push to Market Pull
MEPTEC
San Jose, CA United States
Website: www.meptec.org
We are entering a period of explosive growth of MEMS in new and existing areas. The 6th annual MEPTEC MEMS symposium titled “MEMS Market Evolution: From Technology Push to Market Pull” will be held on 5/22/08 in San Jose, CA. and will explore new applications, market opportunities, and enabling technologies for MEMS, including emerging biomedical, automotive and consumer sectors as well as the Impact of emerging Wafer Level Packaging and 3D ICs on MEMS foundries and MEMS Industry.
May 22
6th Annual MEMS Symposium
MEPTEC
San Jose, CA United States
Phone: 650-714-1570
Email: bcooper@meptec.org
Website: www.meptec.org
MEMS Market Evolution: From Technology Push to Market Pull
May 27-30
ECTC 2008 - the 58th annual Electronic Components & Technology Conference
Lake Buena Vista, FL United States
Website: www.ectc.net
Attendees from around the world will benefit from: more than 300 peer-reviewed
technical papers, 39 technical sessions, including two poster sessions and a special student poster session, 16 Professional Development Courses. Emerging Technology Sessions,
Panel Discussions, and a
Plenary Session.
May 30
The Suppliers Forum & Networking Series
Santa Clara, CA United States
Website: www.fsa.org/events/2007/0530/overview.asp
The Suppliers Forum & Networking Series showcases an array of suppliers presenting their products, services and solutions that address the business needs of fabless, IDM and OEM companies. This half-day event features up to five vendors per track with a complimentary cocktail reception.
June 03
Design for System‐in‐Package
National Microelectronic Institute
Cambridge United Kingdom
Phone: +44 (0) 1506 401210
Email: rachel.wall@twi.co.uk
Website: http://www.nmi.org.uk
A joint NMI, TWI seminar covering design methodologies and applications of this
rapidly growing, high density, high performance and low cost-per-function
microelectronics systems integration technology.
June 03-05
SMT Hybrid Packaging 2008
Mesago Messe Frankfurt GmbH
Nuremberg Germany
Phone: +49 711 61946-34
Email: smt@mesago.messefrankfurt.com
Website: www.smt-exhibition.com
Europe's trade fair and conference for system integration in microelectronics.
June 08-13
45th Design Automation Conference
Anaheim, CA United States
Website: www.dac.com
The Design Automation Conference (DAC) is an event for the design of electronic circuits and systems, and for Electronic Design Automation (EDA) and silicon solutions
June 10-12
2008 International Workshop on EUV Lithography
EUV Litho, Inc. and SPIE
Maui, HI United States
Phone: 512-462-2290
Email: info@euvlitho.com
Website: www.euvlitho.com
Participants will gain an overview of EUVL technology and brainstorm innovative solutions to address current technical challenges. EUVL-related topics covered under this workshop are source, exposure tools, mask, optics, resist, contamination, metrology, patterning and cost of ownership.
June 16-19
Freescale Technology Forum
Freescale Semiconductor
Orlando, FL United States
Phone: 512 996 5134
Email: robert.hatley@freescale.com
Website: www.freescale.com/ftf
Media and analyst attendees will come away with a clear understanding of Freescale's strategic direction and product and technology roadmaps.
July 14
IMAPS/SEMI Wirebonding Advanced Technology Workshop
IMAPS, SEMI
San Francisco, CA United States
Website: www.imaps.org/wirebonding
The objective of this new Wire Bonding workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of wire bond interconnections. This workshop enables discussion and presentation of the latest wire bonding technology.
July 14-18
SEMICON West
SEMI
San Francisco, CA United States
Website: www.semiconwest.org
July 15-17
Intersolar North America
SEMI, Freiburg Wirtschaft Touristik und Messe GmbH & Co. and Solar Promotion GmbH,
San Francisco, ca United States
Website: www.intersolar.us
SEMI, as well as Freiburg Wirtschaft Touristik und Messe GmbH & Co (FWTM) and Solar Promotion GmbH, organizers of Intersolar, a trade fair for solar technology, are partnering to host Intersolar North America. The new exposition will be the largest trade event serving the full solar energy supply chain to be held in conjunction with SEMICON West.
July 18
MEMS BUSINESS AND MANAGEMENT
MIG
San Francisco, CA United States
Phone: 617-876-2770
Email: maria@vetrano.com
Website: www.semiconwest.org/ProgramsandEvents/ShortCo
ursesandWorkshops
MEMS Business and Management is a one-day course exploring strategic and tactical business factors for MEMS opportunities in a wide range of markets including automotive, industrial, consumer, telecom and biomedical industries.
August 01
electronicIndia
Messe Munchen
Bangalore India
September 05-10
SPIE Photomask Technology 2008
SPIE
Monterey, CA United States
Email: peterb@SPIE.org
Website: spie.org/photomask.xml?WT.mc_id=RCALENDARW
The annual SPIE/BACUS Symposium is a technical conference and exhibition for the photomask industry. Issues discussed include: mask infrastructure, mask integration, emerging mask technology, and mask business.
September 07-12
EOS/ESD Symposium and Exhibits
Tucson, AZ United States
Email: info@esda.org
Website: www.esda.org/symposia.html
EOS/ESD Symposium and Exhibits
The international technical forum on electrical overstress and electrostatic discharge. The program features technical papers that emphasize the latest research and technology; tutorials; exhibits of ESD control products and services; workshops; authors' corners; Program Manager Certification; Device/Design Certification; and more.
September 07-12
30th ANNUAL EOS/ESD Symoposium
ESD Association
Tucson, AZ United States
Phone: 315-339-6937
Email: info@esda.org
Website: www.esda.org/symposia.html
The EOS/ESD Symposium consists of tutorials, technical sessions, workshops, and exhibits that are dedicated to ESD education, training, networking, and solutions.
September 22-24
Ultra-Clean Processing of Semiconductor Surfaces
IMEC
Brugge Belgium
Email: ucpss@momentum-pco.be
Website: www.ucpss.org
UCPSS examines ultra-clean processing technology in all steps of IC-production. The conference consists of invited presentations, as well as selected contributing presentations and posters.
September 24-25
IPC Midwest Conference & Exhibition
Schaumburg, IL United States
Phone: 877-472-4724
Email: shows@ipc.org
Website: www.ipcmidwestshow.org/
September 25-26
Manufacturing and Reliability Challenges for 3D ICs using TSVs
SEMATECH
San Diego, CA United States
Phone: 518-956-7395
Email: larry.smith@sematech.org
Website: www.sematech.org/meetings/sks.htm
Successful iintroduction of 3D ICs will require a mature understanding of manufacturing and reliability challenges. You are invited to join other industry experts from arround the world to address these issues.
September 29-October 01
Organic Semiconductor Conference
OSC 08 Europe
Frankfurt Germany
Phone: 44-1223-421525
Email: osc-08@cintelliq.com
Website: www.osc-europe.com
The OSC is an international gathering for the discussion, demonstration, and evaluation of organic semiconductor technologies and organic electronics.
October 10-14
23rd Annual Clinical Cytometry Meeting
Clinical Cytometry Society
Portland, OR United States
Website: www.cytometry.org
October 14-16
Advanced Technology Workshop on
IMAPS
Palo Alto, CA United States
Phone: 978-499-4990
Email: dsaums@dsa-thermal.com
Website: www.imaps.org/thermal
This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems.
November 05-06
6th International System-on-Chip Conference, Exhibit, and Workshops
Savant Company Inc.
Newport Beach, CA United States
Email: SoC@SavantCompany.com
Website: www.SoCconference.com
There is a call for abstracts and speaker presentations. This year’s theme is Innovation in Chip Design and papers will be addressing the most innovative technologies, methodologies, tools, and system solutions for design and development of complex multicore SoCs, ASICs, and ASSPs in the emerging markets.
November 06-08
IMAPS 2008
IMAPS
Providence, RI United States
Website: www.imaps.org
December 15-17
IEEE International Electron Devices Meeting
IEEE
San Francisco, CA United States
Phone: 301-527-0900
Email: iedm@his.com
Website: http://www.his.com/~iedm/
A Call for Papers has been issued for this year's IEEE International Electron Devices Meeting (IEDM). IEDM 2008 will be held in San Francisco Dec. 15-17, 2008, preceded by two Short Courses on Sunday, Dec. 14.
May 31-June 04
57th ASMS Conference on Mass Spectrometry
American Society of Mass Spectrometry
Philadelphia, PA United States
Phone: 505-989-4517
Fax: 505-989-1073
Email: office@asms.org
Website: www.asms.org
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