2008 |
2007 |
2006 |
2005 |
2004 |
2003 |
2002 |
2001 |
2000 |
Web Exclusive Articles
New Products |
Industry News |
Archives Home
New Products 2008 P6
Flexible Pulsed Laser Platform for Industrial Microprocessing
The PyroFlex 2 series of industrial pulsed laser platforms is capable of shaping pulse parameters to exact specifications for microprocessing applications. The platform utilizes a unique software pulse control process. It combines the advantages of proven high-reliability fiber-coupled laser diode pumping technology with the benefits of programming control, and incorporates an optional optical isolator for good pulse stability.
UV Curable Polymer System
The UV10SP-2A one-component, flexible, UV curable polymer system for bonding, sealing, and coating is a 100% reactive, moderate viscosity liquid at ambient temperatures that does not contain any solvents or other volatiles. When exposed to a UV light source, the system cures as a durable, tough, non-yellowing system that can be used as an adhesive, sealant, and coating. Maximum absorption of UV energy takes place in the 250–365-nm range.
Stand-alone Break Processor
The model DB-6100 stand-alone break processor speeds up sapphire wafer separation. Increasing quantities and continuous price pressure, resulting in cost reduction programs, is driving the die size of photonics components, especially LEDs, further down. Efficient die separation with very small compound semiconductor devices is becoming therefore more of an issue.
Thermal Limit Monitor
This custom version of the TLM-8 thermal limit monitor supports applications that have a need for higher accuracy temperature limits or specific limit settings not otherwise available. This version is a good fit for application in industries such as packaging, plastics injection molding and extrusion, and semiconductors requiring SEMI S2.
Wire Bonder
The Wire Bonder 3200's new air bearing technology and rotary axis enable it to attain 22 wires/sec with very thin wires (for diameters down to 35 µm, or 35 thousandths of a millimeter). The wire bonder makes the electrical connections between the semiconductor and the terminals on the substrate. The control pulses generated in the chip reach the surrounding area via a gold wire that is thinner than a human hair.
Golden Track Technology
The "golden track" technology meets the challenges of electro-static stiction of small and thin devices in the tracks of the MT9928 platform. The tracks get a dedicated coating, which ensures a smooth handling of devices down to 2 × 2 mm size and a thickness down to 0.3 mm. The
Jet Dispensing System
The PicoDot jet dispensing system brings new capabilities to EFD's line of precision fluid dispensing systems. Because the PicoDot systems do not contact the substrate, they will enable manufacturers to deposit controlled amounts of fluid on hard-to-access areas, uneven surfaces, or in applications where a conventional dispensing needle cannot be used — at speeds up to 150 dots/sec.
Automated Optical Inspection System
This company's latest M1 AOI system, the M1m, has been developed with special design enhancements to address the advanced inspection challenges presented by complex wire bonding, epoxy splash, and ever-shrinking component sizes. The system offers advanced high-speed device inspection with good defect coverage.
Glass for Wafer-Level CSP and Optics
The AF 32 glass is designed for leading-edge opto-electronics, image sensor packaging, WLO, and MEMS applications. It matches the CTE of silicon, which helps prevent warp during the manufacture of complex assemblies and during reflow, when a WLCSP imager is attached to a printed circuit board.
All-surface Macro Defect Inspection Module
The AXi 940 module will perform wafer front-side inspection as part of the all-surface Explorer Inspection Cluster, a multisurface inspection system designed to provide reliable macro inspection. The AXi 940 has a redesigned software interface focused on reducing cost of ownership through improved productivity and reliability, as well as reduced dependence on human operators.
PAGE:
1 |
2 |
3 |
4 |
5 |
6 | 7 |
8 |
|
|
|
|
Search Articles
Advanced Search
|
Return to Previous Page
|
Web Exclusives 