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New Products 2008 P5
Epoxy Resin System
EP21LM-3, a two component, medium-viscosity epoxy resin system from Masterbond is suitable for high-performance bonding, encapsulation and coating. EP21LM-3 readily develops high physical strength properties including a tensile modulus greater than 100,000 psi (690 MPa) and a tensile shear strength greater than 2300 psi (16 MPa). A viscosity of 37,000 cps allows the product to flow evenly and smoothly without application of pressure.
Probing Adapter for 60 Pin DDR BGA
Ironwood Electronics' LA-BGA88D-FLASH-PSRAM-01 Logic Analyzer Adapter is said to allow high-speed operation, simultaneously enabling memory device analysis in PDAs, cell phones, digital cameras and MP3 players that use Tektronix Logic Analyzer System.
Self-cleaning Squeegee System
The Permalex Paste Manager, from Transition Automation, is a self-cleaning squeegee system based on microprocessor controlled torque actuators. Offered as a solution to the ongoing problem of solder paste sticking to squeegees inside screen printers, this electronically actuated version of the company's Paste Manager reportedly achieves 90% cleaning in 3.9 seconds for a 14″ squeegee.
X-ray Inspection System's Added Viewing Capabilities
The X-Tek Group
The advanced viewing capabilities of the Revolution X-ray inspection system include a Quad View facility and dual LCD monitors to enhance its viewing capabilities and usability. The Quad View facility allows four images to be displayed at once, which enables a more thorough inspection of substrates and is a useful tool for image comparison for operators.
Soldering Materials
Nihon Superior Co. Ltd.
A new, expanded range of SN100C soldering materials are now available, including no-clean ePaste for general reflow purposes, ePaste, a special low voiding paste for critical applications such as die attach in which heat transfer though the joint must be maximized; and a high-performance solder paste with a general purpose "P500" flux medium.
Advanced Placement System
Juki Corp.
The CX-1 advanced placement system is capable of placing SiP, MCM and other mixed-technology applications. The CX-1 is built on the base of a standard SMT machine, but with highly accurate glass linear encoders. Special software periodically checks and calibrates to ensure ultra-high accuracy.
Line of Assembly Materials
Heraeus Contact Materials Division
This company's latest versions of its assembly materials will include conductive and nonconductive adhesives for die attach and flip chip applications, heat conductive adhesives for thermal management, and dippable solder pastes for BGA packaging. Given the increasing complexity of BGA packages and the sensitivity of the polymer substrates to multiple thermal processes, the ball dippable (BD) paste series enables manufacturers to utilize SOP substrates while maintaining outstanding yields.
Flash Vector Programming System
BPM Microsystems
The Flashstream Flash Vector programming system offers a fast flash programming of NAND and NOR flash memory at speeds as low as 2.5% over theoretical programming minimum. This speed is due to the creation of this company's proprietary co-processor technology called Vector Engine, which accelerates flash memory waveforms during the programming cycle.
High-performance Socket for 0.5-mm Pitch SOIC IC
The SG-SOIC-3000 GHz sockets for SOIC chips are ZIF sockets and provide good signal integrity. The sockets are compact and can be mounted on the small footprint. The socket needs about 2.5 mm extra space around the chip than the actual chip size.
Cost Analysis Tool for 3D IC Manufacturing
This intuitive cost-of-ownership (CoO) tool model is specifically designed to evaluate the cost of a given through-silicon-via (TSV) process flow. It has been developed using Excel so as to be widely exploitable and upgradable. This CoO tool will enable evaluation of the cost/wafer level for manufacturing TSVs using user inputs or pre-defined parameters.
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