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New Products 2008 P4
Optical Socket
Centipede Systems has developed an optical socket suitable for testing the current and next-generation wave of chips used in wafer-level camera modules. The initial optical socket entry, part of Centipede's Centurion product line, is offered in a clamshell configuration for an individual integrated circuit. Currently, Centipede's optical sockets with a grid pitch as small as 0.4mm are available.
Radio Opaque Epoxy System
Master Bond Polymer System EP21BAS is a radio-opaque two-component epoxy compound that cures readily at ambient or more quickly at elevated temperatures. A user-friendly, one-to-one (1/1) mix ratio by weight or volume facilitates processing. Additionally, properties of the cured system can be adjusted by altering the mix ratio.
Epoxy Flux Technology
Hysol FF6000, from the electronics group at Henkel, is a reflow curable material formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress. Unlike traditional capillary underfill processes, this material enables an in-line alternative that affords thorough device protection as well.
Thermally Conductive Adhesive Tape
TC-20SAS, a thermally conductive silicone double-sided adhesive tape is from Shin-Etsu Chemical Co., Ltd. provides thermal resistance and electrical insulation properties in addition to its thermal conductivity of 0.7 W/m∙K and its adhesiveness. The thickness of this new silicone adhesive tape is 200µm and its standard size is 300mm x 400mm. Thus, it can respond to desired size. Mass-production of the tape is scheduled for June 2008.
Pyramid Probe Card
Cascade Microtech's 20 GHz P30 Pyramid Probe for high-volume wafer testing of RF filters and switches uses unique membrane probe technology to reportedly achieve higher yields, lower maintenance and minimal down time. The P30's lithographic probes accuracy are said to alleviate uncontrolled impedance, which is characteristic of other probe types, and their compact size enables multi-site testing.
Automatic 200-mm Prober for LED Market
The Pegasus S200A automatic 200-mm prober from Wentworth Laboratories, Inc. is the latest addition to the company's wafer prober line. Intended for high-volume wafer probing of light emitting diodes (LEDs), it also tests discrete devices and wafers up to 200-mm. Pegasus S200A is integrated with production LED testers to bring a fully automatic test platform to the LED production test floor.
Automatic Multi-chip Bonder
ASM Pacific Technology's latest generation large-area chip bonder, the MCM12, is said to address the growing market for MCM, SIP, and hybrid applications. It is a fully automatic multiple die, SMD, and flip chip bonding system with up to 300-mm wafer handling capability. Direct die, flip chip, stack die, and SMD bonding can all be integrated into this single platform tool.
Zestron Showcases FAST Technolgy at NEPCON China
(April 8, 2008) Mansassas, VA — ZESTRON announced it will showcase its latest fast acting surfactant technology (FAST) during the 2008 NEPCON Shanghai tradeshow from April 8th to April 11th at the Everbright Convention and Exhibition Center, Shanghai, China.
UV Laser for High-speed Die Singulation
The AVIA 355-23-250 from Coherent, Inc. delivers over 8 watts of 355-nm output at repetition rates of 250 kHz and higher. The combination of high average power and high pulse repetition rate translates directly into high process throughput with minimal silicon microcracking, reportedly achieving high-speed IC die singulation with high yields.
Acoustic Profiling Module
The Acoustic Surface Profile (ASP) module from Sonoscan allows its C-SAM acoustic microscopes to reveal the external surface topography of a device at the same time as its internal features. It reportedly requires no additional scanning time because profile data is taken at the same time as the acoustic image data. If a part is tilted, ASP corrects for tilt before profiling the surface.
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