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New Products 2008 P3
Thin-film Resistor Networks
Providing design engineers with a variety of substrate materials to suit specific applications and requirements, TT electronics BI Technologies offers its thin film
resistor networks on both silicon and ceramic substrates. The S Series precision resistor networks are constructed using a silicon substrate, while the Model 660 precision thin film networks use a ceramic substrate.
Dual Shuttle Dispense System
The Spectrum S-822 dispensing system from Asymtek allows parallel processing on two shuttle stages for continuous dispensing for reportedly increased productivity in such processes as chip scale package (CSP) underfill and other advanced electronics applications.
Electromechanical Coating Processes
eG ViaCoat is the latest in Alchimer's eGTM series of electrochemical coating processes, for the metallization of high aspect ratio through-silicon vias (TSVs) used in advanced 3D packaging applications. It reportedly produces conformal, thin, uniform, and adherent copper seed layers, even on resistive barriers. It is said to enables significant reductions in cost of ownership (CoO) compared to dry vacuum processes.
Process Development, Optimization and Cost Reduction Program
Rather than introducing a new product, Zestron America will showcase its process development, optimization and cost reduction program at SMT/Hybrid/Packaging 2008. Member of ZESTRON's chemical engineering team will be on hand to provide solutions for cleaning needs before, during, and after process implementation.
Stencil Cleaner and Ultrasonic Immersion Cleaner
Kyzen introduces AQUANOX A4241 stencil cleaner, and AQUANOX A4651US for use in ultrasonic immersion cleaners. Both products provide brilliant solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring; are non-hazardous, biodegradable aqueous solution free of CFCs and HAPs; are multi-metal safe; and have been proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.
Lead-free Solder Paste
The XF3 lead-free solder paste from Balver Zinn was reportedly developed to accommodate extended reflow profiles without the use of nitrogen. It completes the family of Cobar products based on Nihon Superior's patented SN100C-alloy.
Advanced Thermal Processing Equipment
The Pyramax 75A reflow oven from BTU International was developed for situations where footprint is an issue, or where high volumes are not required. It features 75″ of heated length and six zones, 350ºC maximum temperature, flexible platform configuration, low power consumption, and a comprehensive menu of options. BTU's exclusive closed loop convection control in addition low operating costs enables a combination of high yield and low running costs.
Automated Handler for Flashstream Technology
Designed to solve excessive programming times in current in-system, JTAG, and in-circuit programming production methods, the 3000FS automated handler from BPM is modeled from the current BPM 3710 handler and contains four Flashstream programming sites. Rated at 1100 devices per hour, It is flexible enough to handle parts in tray, tube, or tape for device input or output.
Multi Flip Chip Bonder for MCM/SiP
The 8800 CHAMEO Multi Flip Chip Bonder from Datacon was developed for high-volume, high-throughput MCM / SiP assembly. Based on the same high-precision, dual-head architecture of its predecessor, the 8800 FC Quantum, it adds multi-flip-chip/MCM/SiP assembly and wafer handling capabilities as required in today's advanced manufacturing environments.
Chemical Monitoring and Replenishing Systems
The Qual-Fil QF Series combines ECI Technologies' chemical monitoring technology with dosing capabilities to address the need for precision metal plating in advanced packaging applications. The modular system supports both electroplating and electroless deposition. It can manage multiple plating baths simultaneously due to online monitoring and automatic replenishment of multiple components.
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