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New Products 2008 P2
CT Inspection System Software
The Quick View CT inspection system from Dage allows users to obtain initial computerized tomography (CT) reconstructions within 5 minutes, compared to previous times of over 20 minutes. This quick view CT software makes CT a more viable process tool for production and failure analysis applications
Lead-free No-clean Die-attach Solder Paste
Indium 9.32 Die-attach Solder Paste is a halogen-free, no-clean, die-attach solder paste used in high-volume manufacturing for lead-free die-attach applications. It reportedly offers a reliable no-clean die-attach solution for clip-bonding, which has been adopted industry-wide as a viable manufacturing method for high-power semiconductors.
QFN Test Socket
The Z-Socket, or impedance socket, from Antares, is an RF QFN test socket developed to combine the reliability of traditional spring-probe technology with the impedance-matching functionality of shorter interconnects at higher price points.
Macro-inspection Software Option
Systems combining multiple inspection tasks in one tool such as frontside, backside and edge inspection traditionally can run only one wafer lot at a time. With Vistec's software package option, Parallel Job Control for LDS3300 C, it is possible to run multiple control jobs at the same time, rather than have single modules sitting idle without measuring a wafer, while other modules are continuously scanning wafers.
Hermetic Microelectronic Packages
TO-250-type hermetic microelectronic packages from CPS Technologies, Inc. were developed for military, electronics, satellite, and aerospace markets, and can be manufactured in a variety of combinations. Products consist of a cold rolled steel frame with hermetic seals made with alloy #52 or copper-cored alloy #52 pins in a compression glass seal or ceramic terminal. Bottom choices can be OFHC copper, copper moly, copper tungsten or glidcop. Braze material is 72% Ag / 28% Cu (BT braze).
Non-silcone Thermal Die Attatch Lid
MT-431, from Lord Corporation, is a non-silicone thermal die lid attach (TDLA) adhesive that was reportedly developed to replace two material processes, with a single effective solution. The material is formulated with thermal and adhesion properties that perform well enough to replace both typical thermal interface materials (TIMS) and lid attach adhesive.
Probe Card for Flip Chip / Bumped Logic Devices
Megamax, the latest addition to Wentworth Laboratories, Inc.'s vertical probe card line addresses major probe card challenges encountered when probing high power flip chip devices such as microprocessor units (MPU's), graphics processing units (GPU's) and System on Chip (SoC's).
Automated Test Handler
Yield improvement and test processing speed are major issues for high-volume manufacturers of LCD driver ICs. The M7522 dynamic test handler from Advantest Corp. was developed to addresses such issues. It offers processing speed and positioning accuracy for fine-pitch tape automated bonding (TAB) and chip-on-film (COF) package devices used in liquid crystal display (LCD) panel ICs.
Dipping Paste
Almit's LFM 48 N Dipping Paste is an alternative to gel pastes traditionally used in BGA package-on-package (PoP) stacked device applications and is also suited for holding larger area devices that exhibit warpage during reflow. A combination of ultra-fine solder spheres and a flux vehicle optimized for a long open time in a dipping tray, it offers reliability advantages to board assemblers at both solder melt and peak reflow temperatures.
Fiber-based Industrial Laser
With over 18 watts of average power at a pulse repetition rate of 200 kHz (pulsewidth < 15 ps), the Talisker, a fiber-based laser from Coherent, enables precision micromachining at high throughput rates with a negligible heat affected zone (HAZ). And with a choice of infrared (1064 nm), visible (532 nm) or ultraviolet (355 nm) output, it can be used on virtually any material type, including metals, polymers, glass and semiconductors.
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