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New Products 2008 P1
Automated Test Handler
Yield improvement and test processing speed are major issues for high-volume manufacturers of LCD driver ICs. The M7522 dynamic test handler from Advantest Corp. was developed to addresses such issues. It offers processing speed and positioning accuracy for fine-pitch tape automated bonding (TAB) and chip-on-film (COF) package devices used in liquid crystal display (LCD) panel ICs.
Dipping Paste
Almit's LFM 48 N Dipping Paste is an alternative to gel pastes traditionally used in BGA package-on-package (PoP) stacked device applications and is also suited for holding larger area devices that exhibit warpage during reflow. A combination of ultra-fine solder spheres and a flux vehicle optimized for a long open time in a dipping tray, it offers reliability advantages to board assemblers at both solder melt and peak reflow temperatures.
Fiber-based Industrial Laser
With over 18 watts of average power at a pulse repetition rate of 200 kHz (pulsewidth < 15 ps), the Talisker, a fiber-based laser from Coherent, enables precision micromachining at high throughput rates with a negligible heat affected zone (HAZ). And with a choice of infrared (1064 nm), visible (532 nm) or ultraviolet (355 nm) output, it can be used on virtually any material type, including metals, polymers, glass and semiconductors.
Thin-film Resistor Networks
Providing design engineers with a variety of substrate materials to suit specific applications and requirements, TT electronics BI Technologies offers its thin film
resistor networks on both silicon and ceramic substrates. The S Series precision resistor networks are constructed using a silicon substrate, while the Model 660 precision thin film networks use a ceramic substrate.
Dual Shuttle Dispense System
The Spectrum S-822 dispensing system from Asymtek allows parallel processing on two shuttle stages for continuous dispensing for reportedly increased productivity in such processes as chip scale package (CSP) underfill and other advanced electronics applications.
Electromechanical Coating Processes
eG ViaCoat is the latest in Alchimer's eGTM series of electrochemical coating processes, for the metallization of high aspect ratio through-silicon vias (TSVs) used in advanced 3D packaging applications. It reportedly produces conformal, thin, uniform, and adherent copper seed layers, even on resistive barriers. It is said to enables significant reductions in cost of ownership (CoO) compared to dry vacuum processes.
Process Development, Optimization and Cost Reduction Program
Rather than introducing a new product, Zestron America will showcase its process development, optimization and cost reduction program at SMT/Hybrid/Packaging 2008. Member of ZESTRON's chemical engineering team will be on hand to provide solutions for cleaning needs before, during, and after process implementation.
Stencil Cleaner and Ultrasonic Immersion Cleaner
Kyzen introduces AQUANOX A4241 stencil cleaner, and AQUANOX A4651US for use in ultrasonic immersion cleaners. Both products provide brilliant solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring; are non-hazardous, biodegradable aqueous solution free of CFCs and HAPs; are multi-metal safe; and have been proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.
Lead-free Solder Paste
The XF3 lead-free solder paste from Balver Zinn was reportedly developed to accommodate extended reflow profiles without the use of nitrogen. It completes the family of Cobar products based on Nihon Superior's patented SN100C-alloy.
Advanced Thermal Processing Equipment
The Pyramax 75A reflow oven from BTU International was developed for situations where footprint is an issue, or where high volumes are not required. It features 75″ of heated length and six zones, 350ºC maximum temperature, flexible platform configuration, low power consumption, and a comprehensive menu of options. BTU's exclusive closed loop convection control in addition low operating costs enables a combination of high yield and low running costs.
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