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Industry News 2008 P8
Thoughts on the News
Progress in New Packages
With 3D through-silicon-vias (TSVs) often dominating package-related news, it would be easy to think that there's nothing worth mentioning in more conventional packaging technology. Many recent announcements from major semiconductor players, however, show that to be false.
SEMICON West 2008: Crossing Boundaries
By Francoise von Trapp, managing editor
Driven by end-system-level design, the next era of electronics will call for the integration of processes across the supply chain, from the chip to the board. This concept is the motivator for the programs at SEMICON West 2008, held July 14-17 at the Moscone Center, San Francisco, which will focus more on back-end processes than ever before.
Occam Process Progresses
By Joseph Fjelstad, Verdant Electronics
One year after the electronics industry was forced to bow to legislative pressure of the EU's RoHS legislation banning the use of lead in electronic solder in July 2006, a solderless assembly process was introduced in response. The standout process, named in honor of the 14th century English monk and logician, William of Occam, was unveiled by Verdant Electronics.
Determining the Right Wafer Bumping Solution
By M.K. Chew and H.G. Su, Unisem-Advanpack Technologies
Wafer bumping is fast becoming the interconnect of choice for wafer level chip scale packages (WLCSPs). This migration is primarily driven by applications like power management devices, ASIC and memory chips, display drivers, Internet routers, microcontrollers, D/A converters, and RF devices that are transitioning from wire bond plastic encapsulated units to flip chips and WLSCPs.
ECTC 2008 Gets Underway in Lake Buena Vista
(May 27, 2008) Lake Buena Vista, FL — The 58th Electronic Components Technology Conference (ECTC), an international conference that brings together the best in packaging, components and microelectronic systems in science, technology and education gets under way Wednesday, May 27, in Lake Buena Vista, FL, with more than 340 technical papers being presented in 36 oral sessions, two poster sessions and a special student poster session.
Barry Industries Introduces Semiconductor Packaging Line
(May 26, 2008) Newburyport, MA — Barry Industries has introduced a line of semiconductor packaging featuring high temperature cofired ceramic (HTCC) technology for aerospace, RF/microwave, semiconductor, and optoelectronic devices.
SEMI Book-to-Bill Falls to .81
(May 23, 2008) San Jose, CA — The conservative mood of the industry and impending fab projects that were put on hold unitl early 2009 resulted in a book-to-bill ratio of .81 for April 2008, according to Stan Myers, CEO of SEMI. This reflects an 8% drop in bookings and 2% drop in billings since March for North America based manufacturers of semiconductor equipment. A book-to-bill of 0.81 means that $81 worth of orders were received for every $100 of product billed for the month.
STATS ChipPAC Honors Suppliers
(May 22, 2008) SINGAPORE — STAT ChipPAC hosted its inaugural Supplier Day, honoring eleven materials and equipment suppliers for outstanding contribution as key suppliers. The awards ceremony, held on May 13 in Singapore, recognized supplier achievements in 3 categories: outstanding overall performance, outstanding service, and special site outstanding service.
3D Integration Tour: Are TSVs the Future of Advanced Packaging?
By Julia Goldstein, contributing editor
(May 22, 2008) San Jose, CA — The "3D Integration North American Tour" came to San Jose on May 15 after stops in Durham, NC and Dallas, TX. The event, hosted by SUSS MicroTec, Surface Technology Systems (STS) and NEXX Systems outlined the current state of the art in through silicon vias (TSVs) and related technology.
Palomar Reveals Key Assembly Processes for Brighter LEDS
(May 20, 2008) Carlesbad, CA — LED lighting is expected to replace fluorescent lighting by 2012, according to Daniel Evans, senior scientist at Palomar Technologies. This is largely due to the fact that LED lighting capabilities already match those of both incandescent and fluorescent in many applications. However, Evans says to achieve this will require continuous improvements in LED devices and packaging to extract ever increasing lumens per watt.
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