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Industry News 2008 P7
MEPTEC Symposium Highlights MEMS Evolution
By Julia Goldstein, Ph.D., contributing editor
(June 3, 2008) SAN JOSE, CA — When Advanced Packaging magazine covered MEPTEC's first MEMS Symposium in 2003, MEMS was a technology with potential that needed to move from a technology-driven to a market-driven approach to succeed commercially. This year's symposium on May 22, 2008 was subtitled "MEMS Market Evolution — From Technology Push to Market Pull," suggesting that the potential has been realized.
The Riley Report
Touchless Nanoassembly
By George A. Riley, Ph.D. contributing editor
For those of us not yet deeply involved in nano technology, an occasional glimpse of that weird and wonderful world is stimulating and sometimes enlightening. My recent opportunity was at the Nano Science and Technology Institute (NSTI) conference June 1-5, 2008 in Boston, in two sessions devoted to integrating nano technology with micro systems.
Entorian Introduces Novel Package-on-Package Technology
(June 14, 2008) AUSTIN, TX — Offered as an alternative to dual-die package stacking, Entorian Technologies, provider of advanced electronic technologies and solutions for enterprise, consumer and other high-growth markets, has introduced RC Stakpak, a low-cost, package-on-package (PoP) stacking technology for DRAM memory.
Unisem Licenses FlipChip International's WLP Technologies
(June 16, 2008) KUALA LAMPUR, Malaysia — Unisem Berhad and its subsidiary, Unisem-Advantpack Technologies (UAT) have entered into an agreement with FlipChip International (FCI) to license FCI's wafer bumping and wafer-level packaging (WLP) technologies. The agreement will reportedly include FCI's core technologies. In return, FCI will become a shareholder in UAT.
Asymtek Celebrates 25 Years in Business
June 16, 2008 — Asymtek, a Nordson company, provider of dispense, coating, and jetting technologies, recently celebrated the company's 25th anniversary. Asymtek's systems are known for innovative technology in dispensing, closed-loop process controls, and patented processes in jetting and coating. SMT Magazine talked to founder, Alec Babiarz about the company's history.
SMT/Hybrid/Packaging 2008: Exhibitor Offerings Span Electronics Supply Chain
Nuremberg, Germany — Bigger and more international than ever, exhibitors at SMT/Hybrid Packaging, June 2-4, Nuremberg, Germany, focused their product showcases around the theme of automotive electronics, or used the venue for the European launch of new products.
Replisaurus Unveils "Middle-end-of-Line" Metallization Technology
(June 10, 2008) KISTA, Sweden and ST. JEOIRE, France — Just because Replisaurus, Inc. has maintained a low profile since announcing their first round of funding in August 2006, it doesn't mean there hasn't been a lot going on for the start-up company. In fact, just the opposite is true. With last week's announcement of the company's acquisition of Smart Equipment Technologies (SET), the company is ready show the world what it's been up to.
Report: China's IC Market
(June 10, 2008) DUBLIN — Research and Markets released an overview of the Chinese market for ICs, with focus on four key emerging markets: Shenzhen, Suzhou, Tianjin, and Chengdu. The report includes the three IC segments: design, manufacturing, and packaging & testing.
Replisaurus Acquires S.E.T.
(June 5, 2008) Kista, SWEDEN— Replisaurus Technologies, Inc., pioneer in nanoscale electrodeposition of metal patterns, has acquired S.E.T. SAS to establish a production site for its integrated and fully automated high-volume manufacturing tools for its proprietary ElectroChemical Pattern Replication (ECPR) technology.
From the Editor
Ushering in a New Era
I have a theory about industry lulls. (That's how I've decided to define this economic downturn – it's really just a lull.) They may wreak havoc on the bottom line, but they are ultimately an impetus for change and growth. They make us sit up and take notice. We ask ourselves, what's not working? What has to happen to recharge the industry? Then we do something about it.
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