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Industry News 2008 P6
Credence and LTX Sign Merger Agreement
(June 22, 2008) MILPITAS, CA and NORWOOD, MA — Credence Systems Corporation and LTX Corporation, both providers of automated test equipment (ATE) for the worldwide consumer semiconductor industry, have entered into a definitive agreement to combine the two companies in a tax-free, all-stock merger of equals.
electronica 2008 to Showcase on Micro and Nanoelectronics
(June 25, 2008) MUNICH, Germany — Microelectronics is a driving force behind innovation for industries such as automotive, biomedical technology, telecommunications, automation technology, environmental engineering and building technology. Micro-nano systems have become so important that electronica 2008 will dedicate a focus area to sub-miniature electronics. Exhibitors will display micro-nano products for automotive, consumer, medical and environmental applications.
Wireless 2.O Conference Addresses Next-gen Wireless
(June 27, 2008) BRISTOL, UK — Silicon South West, the UK network for the region's electronics industry, will host 'Wireless 2.0', a conference intended to gather key players, analysts, and influential academics for an agenda-setting debate on innovation opportunities fror the next generation of wireless technology. The event is set to take place July 10th & 11th, 2008 in Bristol UK.
iNEMI Roadmap Workshop Scheduled for Shanghai
(June 27, 2008) SHANGHAI, China — The International Electronics Manufacturing Initiative (iNEMI), has scheduled a workshop — to be held in conjunction with the ICEPT-HDP conference in Zhangjiang, Pudong — to give industry the opportunity to review "work in progress" on the 2009 iNEMI Roadmap. This workshop is the third of three regional meetings held in North America, Europe and Asia.
LORD Corp. Expands Labs, R&D Center
(June 26, 2008) CARY, NC — LORD Corporation, supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry, will embark on a $2.5 million renovation to its electronic materials labs in Cary, N.C. The expansion is intended to allow the company to add capabilities for technology development, such as individual package device reliability testing, said John Hill, technology manager for LORD's electronic boards and components industry group.
Towa's Novel Chip Packaging Technique Uses Less Gold
(June 24, 2008) KYOTO, JAPAN — Towa Corp., manufacturer of molding systems for semiconductor devices, anounced the development of a novel compression molding system that uses reportedly 60% thinner gold wires. The traditional transfer molding process, in which the resin is poured across the substrate, require gold wires to be at least 25 µm in diameter to withstand the resin's drag force without breaking. With Towa's new process, the gold wires can be made as thin as 16 µm.
Verigy Gains Business and Recognition from STATS ChipPAC
(June 24, 2008) Cupertino, CA — Semiconductor test company, Verigy, announced that STATS ChipPAC Ltd., provider of semiconductor assembly and test services, has purchased its Port Scale RF systems for testing highly integrated wireless RF devices. In addition, Verigy was recently recognized by STATS ChipPAC with an Outstanding Overall Service Award for exemplary performance and service.
The $38 Billion Blunder: A Rebuttal
Rick Short, marketing communications director for Indium Corp. doesn't quite see eye to eye with recent commentary on the cost of lead-free compliance in the electronics industry in a recent segment of The Riley Report, George Riley's monthly column in AP Semi-monthly. In this editorial, Short offers his perspective on this controversial topic
Wafer Scanner for Bump Metrology
The WS 3840, Rudolph Technologies' latest addition to the Wafer Scanner product family for inspection and metrology, integrates the company's laser triangulation technology for 3D bump metrology and sensitive 2D image-based macro defect inspection on the same wafer handler platform that is used by all of its advanced inspection and metrology tools. Laser triangulation reportedly allows for fast and accurate measurement of bump height and coplanarity.
From the Editor
The Envelope Please.....
Each year when we start the process for the Advanced Packaging Awards, we never really know what to expect. Innovation shifts the focus on development from year to year. Some years there's an abundance of new equipment represented, some years its materials and processes. As industry trends develop, new categories that we feel deserve recognition come to mind.
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