Web Exclusive Articles
New Products |
Industry News |
Archives Home
Industry News 2008 P5
EDA Consortium Reports Revenue Decline
(July 7, 2008) SAN JOSE, CA — The EDA Consortium (EDAC) Market Statistics Service (MSS) has reported a 1.2% decline in electronic design automation (EDA) industry revenue for Q1 2008, from a Q4 2007 revenue of $1366.8M to $1350.7M. The four-quarter average growth rate, which compares the most recent four quarters to the same four quarters in the prior year, was up 5.9%.
High-speed, Fully Automatic Wedge Bonder for Wire and Ribbon
The BONDJET BJ820, from Hesse & Knipps, is a high-speed, fully automatic wedge bonder for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon. It reportedly offers bond speeds up to 7 wires-per-second.
Amkor Introduces Novel Flip Chip Technology
(July 2, 2008) CHANDLER, AZ — Amkor Technology, Inc. announced the introduction of a high-performance flip chip packaging technology using an advanced molding process technology that is expected to provide a number of design, cost and performance advantages for field programmable gate arrays (FPGAs), CPUs, graphics processors, and ASICs. The company plans to feature this technology during SEMICON West 2008, July 15 - 17, in San Jose, CA.
Indium Receives Quality Award
(July 1, 2008) UTICA, NY — Indium Corp.was recognized by Diodes, Inc. as a recipient of the "Full Mark Supplier" Quality Award for the 3rd Quarter of 2007. Guoping Lu, quality manager for Diodes/Kaihong Electronics Co. Ltd., presented the award to Indium Corp's Andy C. Mackie, Ph.D., product manager for semiconductor assembly materials, and Michael Qiu, area sales manager for semiconductor assembly Materials in China.
VLSI Research Announces 10 Best Suppliers of 2008
(July 1, 2008) SANTA CLARA, CA &%151 VLSI Research, a public source for customer feedback on semiconductor equipment, recently announced the winners of the 2008 BEST Awards. Recognizing the top 10 equipment suppliers in three areas of semiconductor manufacturing — wafer processing and diagnistics; chip making; and test, handling and assembly equipment — the results are based on 4,565 surveys collected from chip makers that represent more than 95% of worldwide chip production.
Henkel Launches Research and Failure Analysis Center with Shanghai University
(July 1, 2008) IRVINE, CA. — To promote electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center. The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China headquarters in Shanghai, China.
Rudolph Receives Order from Micronas
(June 30, 2008) FLANDERS, NJ — Rudolph Technologies, Inc. has received a follow-on order from Micronas for both NSX Inspection System and Discover in-line defect analysis and data management software. The purchase will reportedly allow Micronas — supplier of integrated circuits (ICs) and sensor system solutions for consumer and automotive electronics — to provide additional inspection capacity demanded by the 100% inspection requirements customers in the automotive market.
Nextreme Receives Grant to Enhance Efficiency of Thermoelectrics
(June 30, 2008) DURHAM, NC — Nextreme Thermal Solutions, manufacturer of microscale thermal and power management products for the electronics industry, has been awarded a grant from the North Carolina Green Business Fund to enhance the efficiency of thin-film thermoelectrics used to convert waste heat into electricity.
A RoHS By Any Other Name...
(June 30, 2008) Gail Flower, editor_in_chief of Advanced Packaging, offers her perspective in a lead-free debate initiated by Rick Short of Indium, in response to a segment of The Riley Report, "The $38 Billion Blunder" penned by AP's columnist, George A. Riley, Ph.D.
June Names in the News
(June 30, 2008) It was a month for names in the news as acquisitions and evolving business strategies inspired executive appointments and reorganization; industry organizations added members and directors, and books got published. Company announcements came in from JP Sercel Associates, TRUMPF, Dage Precision Industries, ECD, Jordan Valley, Rogers Corp., Formfactor, Unisem Group, Mentor Graphics, and Alchimer.
PAGE:
1 |
2 |
3 |
4 |
5 | 6 |
7 |
8 |
9 |
10 |
11 |
12 |
13 |
14 |
15 |
16 |
17 |
18 |
19 |
20 |
21 |
22 |
23 |
24 |
25 |
26 |
27 |
28 |
29 |
30 |
31 |
|
|
|
|
Search Articles
Advanced Search
|
Web Exclusives 