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Industry News 2008 P4
Stan Myers, SEMI, Provides Perspectives on R&D and Outlook for the Semiconductor Industry
(July 14, 2008) SAN FRANCISCO — Setting the tone for the week's events, Stan Myers lead off SEMICON West's opening press conference, presenting the latest trends worldwide, midyear equipment forecast by market segment, and reporting the findings of the SEMI equipment productivity working group's (EPWG).
Electronics Industry Association News
(July 14, 2008) — IMEC and Qualcomm collaborate on 3D packaging technologies; IPC meets internationally to discuss urgent trends; iNEMI releases recommendations for lead-free alloy alternatives.
STMicroelectronics to Manufacture TSV-based Image Sensors on EV Group 300-mm Tools
(July 8, 2008) ST FLORIAN, AUSTRIA — EV Group(EVG)announced the order and successful installation of its 300-mm bonding, alignment, and photoresist fully automatic processing tools at ST Microelectronics'(ST) 300-mm through-silicon-via (TSV) pilot line in Crolles, France. The company says the tools will be used in the manufacture of CMOS imaging sensors (CIS) Using TSV technology.
Advanced Probe Card Analysis Improves Yields, Speeds Product Development and Reduces Test Costs
By Darren James, Rudolph Technologies, Inc.
With the cost of some advanced packages reaching several times the cost of the die they contain, the value contributed by functional testing, which allows manufacturers to avoid the cost of packaging defective die, has grown dramatically. Of course, testing has its own costs in both money and time.
Thoughts on the News
Plenty of Pre-SEMICON West Developments
Jeffrey C. Demmin, contributing editor
With SEMICON West just around the corner, many companies recently announced new products or technologies — Aviza, Replisaurus, and Helic to name a few — and there have been some corporate maneuvers as well. Let's begin with some new standards from SEMI.
From the Advisory Board
3D Packaging Advances Keep Coming
By Michael Todd, Ph.D. the electronics group of Henkel
Never content to rest on its laurels, the packaging industry continues to demand more from today's 3D devices. And, while performance improvements and footprint reductions are certainly driving factors for advancement, the real issue is cost.
From the Editor
The View from the Middle
Have you ever noticed that the stages of electronics manufacturing seem to be categorized incorrectly? In my opinion, dividing it into semiconductor manufacturing and final assembly, with the semiconductor sector further partitioned into front- and back-end, gives a distorted view of the industry as a whole. Call me crazy, but I've always felt like assembly packaging and test were really middle processes, connecting the front-end with final assembly.
Advanced Packaging Roadshow: Northwest Passage
Near Nature; Near Perfect
By Gail Flower, editor-in-chief
Early this spring the Advanced Packaging Roadshow flew out to Wilsonville, Oregon, to visit Mentor Graphics Corporation's U.S. headquarters, which is situated in a beautiful, park-like setting. The beauty of nature — with nutria feeding on the grounds, ducklings gathering in the lake, tulips in bloom, and greening outdoor soccer fields — provided a great spot for quiet thinking.
Henkel Expands into South Africa
(July 8, 2008) IRVINE, CA — As part of its expansion strategy into established and emerging electronics manufacturing regions, the electronics group of Henkel announced a distribution partnership with PEM Technologies in South Africa to represent its line of Loctite brand electronics adhesives.
Countdown to SEMICON West: Exhibitor Preview
(July 7, 2008) SAN FRANCISCO, CA — With SEMICON West 2008 just one week away, July 15-17,at the Moscone Center, San Francisco CA, exhibitors are getting the word out to make sure attendees don't miss a thing. While SEMI has a full-line up of conferences, keynotes, and workshops planned, many exhibitors will be leveraging the venue to announce new processes, technologies, products, and more.
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