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Industry News 2008 P3
From the Editor
Congratulations to the survivors of last week's annual semiconductor sensory overload, known to most as SEMICON West. As I sprinted from hall to hall, attending press conferences, technology sessions, and visiting with as many exhibitors as was humanly possible, greeting colleagues in passing who were trying to accomplish the same, it occurred to me that what we all set out to do in the course of 4 days isn't all that different from what Olympic athletes will try to accomplish in a few weeks.
The Riley Report
Embedded Components and Disappearing Die
By George Riley, Ph.D., contributing editor
(July 22, 2008) — While dozens danced around the TSV tree at SEMICON West in San Francisco last week, none claimed to have climbed it to the top. Meanwhile, in faraway Europe, a group of buried-chip miners continue tunneling towards a potential goldmine of 3-D heterogeneous assemblies. Will they find it?
Hermes European Embedded Dies Consortia Partners with Flip Chip International
(July 8, 2008) PHOENIX, AZ — Hermes, the Eurpoean consortia for the development and industrialization of embedded die technology, has partnered with Flip Chip International (FCI) to leverage the company's proprietary embeddable die customization (EDC) technology to enable the consortium's pursuit of heterogeneous systems integration.
Multi Flip Chip Assembly for the Mass Market
By Christian Pichler, Datacon Technology GmbH
Originally targeted to high-end applications, flip chip assembly technology is rapidly finding its way into low-end applications for high-volume products with multiple chips, due to cheaper substrates and cost-effective bumping. This requires high speed and precision, which can be achieved cost-effectively by processing directly from the wafer using tried-and-tested, high-throughput flip-chip bonder platforms.
ECPR — Micro-cell Plating for Advanced Packaging
Affordable Accuracy at High Speeds
By Patrik Möller and Mikael Fredenberg, Replisaurus Technologies
ECPR technology introduces a new way to fabricate highly accurate metal patterns that combines patterning and metallization into one single process step. By simplifying the process sequence a highly reproducible metallization method that offers advanced process control functions and short feedback loops has been developed.
Packaging Requirements Key to Advancing Wafer Bonding Technology
By Paul Lindner, EV Group, St. Florian, Austria
Well-established as a process for forming silicon-on-insulator (SOI) substrates, wafer bonding is broadening its horizons to encompass bonding wafers for a variety of fast-growing applications. Regardless of the materials involved, packaging has emerged as the primary underlying driver. As wafer bonding technology evolves, key market, application, and industry trends can be linked to emerging advanced packaging requirements.
2008 Advanced Packaging Award Winners Announced At SEMICON West
(July 17, 2008) SAN FRANCISCO — Once again, SEMICON West provided the perfect backdrop for Advanced Packaging Magazine to announce the recipients of the 8th annual Advanced Packaging Awards, recognizing excellence in industry innovation. During an elegant celebration and ceremony held at the St. Regis Hotel, Wednesday, July 16, 2008, Gail Flower, editor-in-chief, Advanced Packaging talked about hope, and commended this year's participants.
K&S CEO Scott Kulicke Offers Industry Insight
(July 16, 2008) SAN FRANCISCO — In a round table discussion over lunch, Scott Kulicke, CEO, Kulicke & Soffa, responded with candor to questions posed by analysts from Prismark Partners, VLSI Research, and TechInternational; and editors from a variety of industry publications. Topics ranged from the success of the company's recent tool launch, last year's acquisition of Alphasem, the transition to copper wire bonding from gold wire, and the state of the industry
SEMICON West Packaging Summit Address Path to TSV Adoption
(July 15, 2008) SAN FRANCISCO — In a panel discussion hosted by Bill Bottoms, CEO of Nanonexus, and Jan Vardaman, TechSearch International, Industry experts from IBM, Intel, R3Logic, TSMC and Amkor emphasized a growing need for TSV adoption, what the drivers will be, how they will be used beyond being a replacement for electronic wiring, and what needs to happen to achieve this by established timelines.
U.S. Election 2008: SEMI Voices Industry Platform
(July 14, 2008) SAN FRANCISCO — Urging presidential candidates to make technology policy a top priority, SEMI North America voiced their agenda for Washington at the SEMI Press Conference, held July 14 during SEMICON West. The agenda zeroed in on four critical areas: technology, tax, talent, and trade.
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