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Industry News 2008 P25

Camera phones are reportedly being manufactured in extraordinary numbers reaching 2–2.5 million per day. At the same time, the trend towards higher resolution is calling for increased pixel numbers. To keep from having to increase the size of the sensor area, pixel size is being decreased. As this happens, bare image sensors become susceptible to yield loss due to particle contamination.

3D Packaging — How to Build 3D Packages from Design through Materials & Equipment
adapted for print by AP editors

This article is the second in a series on 3D packaging technology, and summarizes information presented during a December 2007 webcast produced and hosted by Advanced Packaging magazine. Participants included: Dan Schmauch and Rozalia Beica, Semitool Inc.; Jean-Marc Thevenoud, Alcatel MicroMachining Systems; and Markus Wimplinger, EV Group.

Large Al Ribbon Bonding: A Reliable Power Interconnect Solution
By Siegbert Haumann, Christoph Luechinger, Kris Oftebro, Garrett Wong, Orthodyne Electronics

Over the last 5 years, ultrasonic bonding of large Al ribbon has developed into a reliable and productive interconnect technology. In smaller form-factor power packages such as the SO-8 and the PQFN, and also in high-reliability automotive applications, it replaces the multiple parallel fine Au or large Al wires with large rectangular-shaped Al ribbons of appropriate thickness and width.

Infineon Ships CMOS RF Switches with GaAs Performance
(February 4, 2008) Neubiberg, Germany — Infineon Technologies has announced it is shipping in volume RF switches that are manufactured in a CMOS-based process on silicon wafers and offer the equivalent performance of RF switches manufactured in gallium arsenide (GaAs) process technology. Infineon went on to say that, previously, CMOS-based RF switches had to be manufactured on dedicated and more expensive sapphire wafers to reach the performance of GaAs switches.

Unisem, KVD Partner to Share US Testing Facilities and Equipment
(February 04, 2008) SUNNYVALE, CA — Unisem Berhad today announced that KVD, a provider of test solutions for the analog-dominant device market, will be leasing part of Unisem's Sunnyvale testing facilities for KVD's analog testing services and solutions for final test and wafer sorting. KVD will have its own engineering staff onsite and will utilize Unisem's onsite training facilities to provide classes for engineers and operators.

KIC Celebrates Its 30th Year in the Electronics Industry
(February 4, 2008) SAN DIEGO, CA — KIC, a manufacturer of thermal process development and control products, announces that it is entering its 30th year of business within the electronics industry. Founded in 1977 by Casey Kazmierowicz, KIC entered the electronics industry with the introduction of the first continuous monitoring system for conveyorized furnaces for microcomputers.

STS receives order from IMS CHIPS
(January 31, 2008) NEWPORT, WALES — Surface Technology Systems plc (STS) has announced that it has sold a Pegasus deep reactive ion etch (DRIE) tool to the Institut für Mikroelektronik Stuttgart (IMS CHIPS). The etch tool will be used for a number of silicon etch applications including fabricating high aspect ratio nanostructures for replication masters.

Motorola to Explore Structural and Strategic Realignment
(February 1, 2008) Schaumburg, IL — Motorola Inc. has announced it is exploring the structural and strategic realignment of its businesses to better equip its Mobile Devices business. The company's alternatives may include the separation of Mobile Devices from its other businesses in order to permit each business to grow and better serve its customers.

ESI Mourns Passing of Former VP, Laser Technology Inventor
(February 1, 2008) PORTLAND — Electro Scientific Industries Inc., a provider of photonic and laser systems for micro-engineering applications, regrets to announce the passing of former senior VP Edward J. Swenson on January 28. He began his tenure with ESI in 1961, and worked his way up the chain of command throughout the years from applications engineer, earning numerous patents along the way.

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