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Industry News 2008 P24
New Study Forecasts Realistic 3D TSV Market
(February 13, 2008) Austin, TX — A new study reports that 3D through-silicon vias (TSV) will eventually be adopted, but the timing for mass production depends on how the cost of the new technology compares with that of existing technologies. Design, thermal, and test issues remain a barrier to TSV adoption in some applications, although progress is being made.
SEMI Publishes Eight New Technical Standards
(February 12, 2008) San Jose, CA — SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD), and MEMS manufacturing industries. One of the standards, the SEMI MS6, provides a guide for design and materials for interfacing MEMS microfluidic systems.
Backend Resist Clean Firm Seeks China Patent
(February 11, 2008) Fremont, CA — Legacy Holding, a provider of wafer cleaning/strip technologies, says it has submitted a patent application for its proprietary "Organostrip" photoresist removal technology used in backend semiconductor manufacturing processes, saying that opportunities in China's IC industry make it a sweet spot for business.
STMicroelectronics Introduces Very Small Single-Chip Camera Sensor
(February 8, 2008) GENEVA — STMicroelectronics reports that it has introduced the market's smallest single-chip camera sensor for mobile applications. Coupling low space requirements with advanced image processing capabilities, ST's latest 2-megapixel mobile-phone camera sensor addresses consumers' appetite for full- featured imaging solutions in ever-more popular thin-profiled handsets.
Comtech, Freescale to Design Automotive Solutions in China
(February 7, 2008) SHENZHEN, China — Comtech Group Inc., a provider of customized design solutions for the technology manufacturing sector in China, is forming an alliance with Freescale Semiconductor. The collaboration will focus on the use of Freescale's semiconductor technology in Comtech's customized module solutions for its OEM (original equipment manufacturing) and ODM (original design manufacturing) customers, with an initial focus on automotive electronics.
Amkor COO Departs — Ken Joyce is Named New COO
(February 07, 2008) CHANDLER, AZ — Amkor Technology Inc. has announced that Oleg Khaykin, COO, is leaving the company to become CEO of another public company. Ken Joyce, chief administrative officer of Amkor, has been named to succeed Khaykin as COO. Joyce joined Amkor in 1997 and was CFO for more than 8 years before becoming chief administrative officer in November 2007.
IIT Bombay Selects EV Group Bonders for Micro-Fabricated Sensor R&D Project
(February 5, 2008) St Florian, Austria — EV Group (EVG) has announced it has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. The systems will be for a new Indian government-supported automotive MEMS R&D project and are slated for installation this month in IIT Bombay's Mumbai facility.
Oerlikon Esec Closes Deal with Greatek Electronics
(February 5, 2008) Cham, Switzerland — Taiwan-based Greatek Electronics Inc. has ordered a significant number of Oerlikon Esec's latest development, the Wire Bonder 3200, according to Oerlikon. This deal is a milestone in the two companies' long and established co-operation.
Microchip Technology Creates New Academic Partner Program
(February 5, 2008) Chandler, AZ — Microchip Technology Inc. has created the new Microchip Academic Partner program, providing an opportunity for academia to partner with a semiconductor industry leader to increase their knowledge base in embedded applications. The program offers free local training and curriculum to educators via Microchip's Regional Training Centers (RTCs) and web site.
Thoughts on the News:
The Latest ITRS Highlights Familiar Issues
By Jeffrey C. Demmin, contributing editor
As always, the annual update to the <>International Technology Roadmap for Semiconductors (ITRS) provides insight and guidance for people involved in the semiconductor industry. A complete biannual update is released at the end of odd-numbered years, so the end of 2007 brought us a new edition.
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