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Industry News 2008 P23
Metris Acquires X-Tek Group
(February 15, 2008) Leuven, Belgium — The X-Tek Group, specialists in microfocus and CT X-ray systems, signed an agreement with Metris for the sale of 100% of the X-Tek stock at the end of 2007. The acquisition will enable Metris to expand X-Tek's CT capabilities into various applications within the metrology industry.
Yole Releases WLP Report
(February 15, 2008) Lyon, France — Yole Developpement has just released a new report entitled "WLP & Embedded Die Technologies 2008". This report presents the manufacturing challenges faced by the wafer level packaging industry in terms of MEMS, CMOS image sensors and semiconductor ICs.
From the Editor
Opportunities in Disguise
February 20, 2008 — I have never been a fan of childproofing a house. There's a false sense of security associated with gates and child safety latches, knobs, and caps. Parents assume if they use these devices, their children are safe from harm. The limits are obvious. But what if you have one of those children who instinctively see these devices not as a limit, but as a challenge to be overcome?
The Riley Report
The Race to Replace Copper
By George Riley, Ph.D., contributing editor
February 20, 2008 — A year is a long time in our fast-moving industry. Changes come so rapidly that not many of us pay attention to problems that are several years away. But researchers are paid to live in the future, and two groups of them are in a race to replace copper in high-performance ICs.
People in Packaging
February 20, 2008 — Since the beginning of February, a number of companies have announced significant shifts in management and personnel. Among them were Amkor, who's COO accepted a CEO position elsewhere; Tessera Technologies, who appointed former CTO of Flextronics to their board; Asymtek, who promoted their European sales and marketing manager to general manager; SUSS MicroTec, who appointed a V.P of sales; and...
Yole Releases Life Sciences BioMEMS Report
(February 14, 2008) Lyon, France — Yole Développement, a market research and strategy consulting company, has released a report on how microelectronics can bring added value to life sciences applications. The key challenge for microelectronics is to make complexity invisible and adapt it to the value chain and standard operations of the life science industries.
Besi Restructures and Merges Laurier into Datacon
(February 14, 2008) Radfeld, Austria — Laurier Inc., a division of BE Semiconductor Industries (Besi) and manufacturers of die handling equipment, is now fully integrated into Datacon Technology GmbH die bonding equipment division. The reorganization consolidates Laurier into Datacon, resulting in a single die handling division.
Slotting MEMS Inkjet Devices with Water-jet Guided Lasers
By Tuan Anh Mai, Ph.D. and Bernhold Richerzhagen, Ph.D., Synova
February 20, 2008 — Inkjet printer heads hold one of the largest shares of the MEMS market. Printer manufacturers generally use thermal bubble jet technology or piezoelectric jet technology. A silicon chip is used as a barrier between the orifice plate, which contains hundreds of nozzles, and the ink reservoir.
Public Tender Offer of Lam Research Corp. Declared Successful
(February 13, 2008) — SEZ Holding Ltd. announced today that on 12 February 2008 Lam Research Corp. has published the preliminary interim results of the public tender offer for all publicly held shares of SEZ Holding Ltd. and has declared the public tender offer successful.
NEC Fabricates CNT Transistor Using Coating Process
(February 13, 2008) Tokyo — NEC Corp. has announced the successful development of a carbon nanotube (CNT) transistor using a coating process. The basic operation of the new transistor with advanced characteristics has been verified, confirming its
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