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Industry News 2008 P21
Amkor Technology Introduces Novel Package Platform
(February 28, 2008) CHANDLER, AZ — Amkor Technology, Inc. introduced FusionQuad, a novel package technology designed for applications that call for high electrical and thermal performance at low cost. Broad application of this package includes consumer electronics, Ethernet, and a variety of applications across all semiconductor markets.
National Semi CEO Highlights Megatrends Driving Chip Industry, Conserving Energy
(February 28, 2008) Osaka, Japan — During his keynote today at the Global Electronics Forum in Osaka, Japan, Brian Halla, chairman and CEO of National Semiconductor Corp., discussed a number of key megatrends that will drive chip industry growth. The megatrends include personal mobile devices with enhanced video displays and on-board video projectors; portable medical equipment; and enhanced security and surveillance devices, including smart sensors for high-precision detectors.
Fundamental Reliability Issues Addressed at Workshop
(February 27, 2008) Owego, NY — Members of Unovis Solutions' 2008 Advanced Research in Electronics Assembly Consortium are gathering for the last day of this two-day conference to review this year's research plan and to review results of recent investigations. Attendees from more than 30 companies and institutions are expected to congregate for an in-depth look at process and reliability-related research in electronics assembly.
Microchip Technology Announces New General-purpose 8-bit PIC Microcontrollers
(February 27, 2008) Chandler, AZ — Microchip Technology Inc. has announced a new family of low-cost, 8-bit Flash PIC microcontrollers (MCUs). The 28- and 40-pin PIC16F722/3/4/6/7 (PIC16F72X) MCUs are capable of operation down to 1.8V and feature a 16 MHz internal oscillator; up to 14 ADC channels; communication (SPI, I2C, AUSART) and two capture, compare and PWM (CCP) modules; plus the mTouch Sensing Solution peripheral.
IPC Sponsors Endicott Technology Interchange: Will You Be Ready?
(February 27, 2008) Bannockburn, IL — Technological advances on the horizon and future industry demands: this is the focus of "Will You Be Ready?: An Endicott Technology Interchange," sponsored by IPC, the Association Connecting Electronics industries. On May 14, Endicott Interconnect Technologies Inc. will open up its headquarters in Endicott, NY, for a day of information exchange and networking in order to provide a vision of future direction and needs.
EIS Honors Henkel with Two Inaugural Prime Source Awards
(February 27, 2008) Orlando, FL — Based on its commitment to success and ability to meet a set of challenging objectives, the Electronics and Industrial Groups of Henkel have been awarded Prime Source Awards from Atlanta-based EIS, an electrical/electronics industry distributor. EIS president and CEO, Bob Thomas, presented the awards to Henkel's Jim Sharp, Electronics Goup southeastern territory manager, and Ken Helfers, industrial group distribution account executive.
Georgia Tech orders STS DRIE Tool for Nano and MEMS Research
(February 26, 2008) NEWPORT, WALES and ATLANTA, GA — Surface Technology Systems (STS)announced that Georgia Institute of Technology (Georgia Tech) ordered a Pegasus Deep Reactive Ion Etch (DRIE) tool for their new Nanotechnology Research Center Building (NRCB), which is due for completion in fall 2008. Georgia Tech is the first university to acquire the latest generation of STS' advanced silicon etch (ASE) systems.
January 2008 Book-to-Bill Edges Up to .89
(February 26, 2008) SAN JOSE, CA — While the book-to-bill ratio has risen steadily to 0.89 since September 2007, when it dipped to .79, billings themselves are still 7% less then December 2007, and 12% less than a year ago, according to the January 2008 Book-to-Bill Report published by SEMI.
Heraeus Opens Upgraded Manufacturing Facility for Assembly Materials
(February 25, 2008) West Conshohocken, PA — Heraeus has opened an 80,000 sq.-ft. upgraded, consolidated manufacturing facility at its Pennsylvania headquarters that includes manufacturing, research and development, quality control labs, and shipping. The upgraded facility includes a 5000 sq.-ft. cleanroom, which will enable Heraeus to continue to produce materials at double the previous capacity.
EV Group Secures Multiple System Order for MEMS-based Motion Sensors
(February 22, 2008) St. Florian, Austria — EV Group (EVG) has announced that it has received a multiple system order from Colibrys for one EVG520 semi-automated wafer bonding system and two EVG620 fully automated mask/bond aligners. One bonder and aligner tool set was installed at the Colibrys Inc. manufacturing facility in Stafford, TX, last month, while the other will be installed at the company's headquarters in Neuchatel, Switzerland before the end of 1Q08.
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