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Industry News 2008 P20

(March 5, 2008) — Spring is approaching, which means that it's time to prepare for more technical information on semiconductor packaging than you can handle. The full program for ECTC is out, but if you can't wait until May for that event, the IMAPS International Device Packaging Symposium this month also provides plenty of fodder for the packaging engineer.

March Events Preview
(March 5, 2008) — March is a busy travel month for the Advanced Packaging editors. In the next few weeks, we'll be reporting from Arizona, where both the BITS Workshop (March 9–12, 2008) and IMAPS' International Device Packaging Symposium, in conjunction with the Global Business Council (March 17–20, 2008), will be taking place; as well as Shanghai, where Gail Flower, editor-in-chief, will attend SEMICON China (March 18–20, 2008).

Thin-film TECs for High-heat Flux Rapid Thermal Response
By Paul A. Magill, Nextreme Thermal Solutions, Inc.

(March 5, 2008) — In the semiconductor industry, device characterization or screening occurs through the use of two related tests: burn-in and elevated temperature device characterization, with both tests using temperatures >99°C: the first to accelerate device failure modes that could be related to those in the field, and the second to simulate functional device behavior while characterizing its performance level.

3D Packaging Processes — Part III
adapted for print by AP editors

(March 5, 2008) — This article is the third in a series on 3D packaging technology, and summarizes information presented during a January 2008 webcast hosted by Advanced Packaging magazine. Participants were: Fred Roozeboom, Research Fellow, NXP Semiconductors and professor at TU Eindhoven; Kai Zoschke, Research Engineer for Fraunhofer IZM; and Thorsten Matthias, Director of Technology North America, EV Group.

FINETECH Shanghai, Kyzen Corp., to Display New Products at SEMICON China
(March 3, 2008) — At SEMICON China 2008, taking place March 18-20 at the Shanghai New International Expo Centre, two of the companies that will showcase new products are FINETECH Shanghai and Kyzen Corp. FINETECH Shanghai will present the FINEPLACER CR7.MD compact rework system at its Booth 2166 and Kyzen will feature its MICRONOX MX2302 engineered semi-aqueous solvent blend at two representatives' booths: WKK's Booth 2636 and Sigmatek's Booth 3725.

Power Integrations Introduces eSIP Power Package to Support Low-Profile Trend in Consumer Electronics
(March 3, 2008) San Jose, CA — Power Integrations today announced the availability of its TOPSwitch-HX series of AC-DC power conversion ICs in the new eSIP-7C eco-single-inline-package. This package exhibits the low thermal impedance of the traditional TO-220, yet stands less than 10mm above the PCB.

Fujitsu Achieves Self-organizing Carbon Nanotube Composite with Graphene
(March 3, 2008) Atsugi, Japan — Fujitsu Laboratories Ltd. today announced the successful formation of a new nano-scale carbon composite featuring a self-organizing structure by combining carbon nanotubes and graphene, which are both nano-scale carbon structures. The newly-discovered composite structure is synthesized at a temperature of 510°C.

ASE Inc. Enters Syndicated Loan Agreement for the Proposed Acquisition of ASE Test Ltd.
(March 3, 2008) Taipei, Taiwan — Advanced Semiconductor Engineering Inc. has announced that it has entered into a syndicated loan agreement with a banking syndicate led by Citibank, N.A., Taipei Branch, for a NT$24,750 million term loan facility.

China Packaging Society President to be Speaker at GBC Conference
(February 29, 2008) Scottsdale, AZ — The IMAPS Global Business Council (GBC) is pleased to announce that Bi Keyun, PhD and president of the China Electronic Packaging Society, will head a delegation from China and will speak at GBC Spring Conference in Scottsdale, AZ, on March 16 and 17, 2008.

Zygo Acquires Assets of Solvision, Enters Semiconductor Back-End Inspection Market
(February 29, 2008) Middlefield, CT — Zygo Corp. has announced that it has acquired the assets of Solvision Inc., a Canadian-based company, including the shares of its Singapore subsidiary. With this acquisition, Zygo enters the market for in-line inspection of flip chip substrates and packaged ICs.

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