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Industry News 2008 P2
Embedded Passives in Device Packaging: What is Limiting Widespread Adoption?
By Dirk. M Baars, Rogers Corp.
The expectation that embedded passives technology will be required to meet size, performance and cost requirements of devices has been a driver of R&D activity in many materials suppliers' laboratories. In particular, the proliferation of multiple-function handheld devices with multiple wireless functions should require that discrete components be integrated into the package to save space and minimize electrical distances for optimum performance.
RF Components and Devices in 3D LCP Package
Part 1: Embedded Actives
By Swapan K. Bhattacharya, Chad Patterson, and John Papapolymerou, Georgia Tech
As real estate in electronic packages has been compromised in the Z direction, thin has become the buzz word — encompassing die, dielectric, passives, and ultimately resulting in thin packages. This series of articles will overview trends from thick to thin packages with embedded RF passive and active components.
Beyond the Bunny: "Printing" Your Way To Battery-free Power
By Arthur L. Chait, EoPlex
Batteries are everywhere, powering everything from laptops to greener vehicles. The first dry-cell batteries were mass-produced in 1896. Today's batteries are vast improvements over these early products. Panasonic recently claimed the Guinness record for longest-life alkaline battery with the Evolta that powered a robot for seven hours as it climbed out of the Grand Canyon.
K&S To Acquire Orthodyne Electronics; Divest Wire Business Unit to Heraeus
(August 1, 2008) FORT WASHINGTON PA — In a strategic move to further capitalize on its strengths as an equipment manufacturer, Kulicke & Soffa Industries announced that the company will acquire the assets of Orthodyne Electronics Corp., while also divesting its wire business unit to W.C. Heraeus GmbH.
FEI and Icon Analytical Selected to Develop India's Premier Imaging Facility
(July 29, 2008) HILLSBORO, OR — India's International Centre for Material Science (ICMS) in Bangalore has selected FEI Company and its Mumbai-based agent, Icon Analytical Equipment Private Ltd., to develop a unique electron microscopy facility in India.
The ICMS Imaging Centre will reportedly include a suite of FEI electron microscopes.
Henkel Names New Electronics Executive Team
(July 25, 2008) IRVINE, CA — Following its acquisition of the Adhesives and Electronics Materials businesses from National Starch and Chemical Company, Henkel has announced its executive team to take the company forward. Under the direction of Alan Syzdek, corporate senior V.P. the electronics group of Henkel will be organized on a global basis by industry sector.
iNEMI Schedules Sustainability Summit
(July 25, 2008 ) Herndon, VA — The International Electronics Manufacturing Initiative (iNEMI) will bring together leaders from industry and academia September 22-23 to identify and prioritize areas where the electronics industry can collaborate on proactive environmental programs.
JPSA Partners with DynTest for Wafer Scriber/Breaker Development
(July 24, 2008) MANCHESTER, NH — J P Sercel Associates (JPSA) and DynTest Technologies of Grassau, Germany, have entered into a collaborative partnership reportedly to develop and manufacture high-precision scriber / breaker solutions for wafer singulation. DynTest specializes in precise, accurate, and efficient breaking systems, while JPSA specializes in high-speed, high-accuracy laser workstations for wafer scribing.
Advanced Packaging and Solid State Technology Applaud 2008 ACA Winners
(July 22, 2008) NASHUA, NH — On Wednesday, July 16, 2008, the editors and publisher of Solid State Technology (SST) and Advanced Packaging Magazine presented the 2008 ACA Awards, in usual impromptu style on the floor at SEMICON West. This was the sixth straight year attendees of SEMICON West were invited to vote on products they saw at the annual trade show.
SEMICON West Exhibitor 2008 Spotlight
by Françoise von Trapp, managing editor
(July 23, 2008) — Traffic was definitely up on the show floor at this year's SEMICON West. Whether or not it had to do with a need to rally the troops in a slow economic climate, or because SEMICON West shared the stage with Intersolar 2008, is still up for debate. In addition to numerous product introductions, exhibitors commented on SEMI recommendations to hold off on R&D spending for transition to 450 mm wafers.
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