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Industry News 2008 P19
Cadence Acquires Chip Estimate Corp.
(March 12, 2008) San Jose, CA — Cadence Design Systems Inc. has acquired Chip Estimate Corp., a company that delivers IC planning and enterprise-level IP reuse management solutions. Founded in 2003, Chip Estimate products enable electronics design teams to predict the die size, yield, power consumption, performance, and cost of chips based on almost any design architecture, IP, and silicon process node options. Terms of the agreement were not disclosed.
BTU Receives $3M Order for Pyramax Products from Leading SATS Company
(March 11, 2008) North Billerica, MA — BTU International, a supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today announced the receipt of a $3M multiple-machine order, the largest single Pyramax order in company history, from a leading semiconductor assembly and test subcontractor (SATS).
Europractice IC Service Expands to MEMS Prototyping
(March 11, 2008) CROLLES, France, and LEUVEN, Belgium — Tronics Microsystems SA and IMEC, representing Europractice IC Service, announced today their collaboration to enable Europractice IC Service to add MEMS to its Multi-Project Wafer (MPW) programs. Tronics, a manufacturer of custom MEMS components, is the first technology provider selected by IMEC to support Europractice IC Service's extension of its production portfolio to MEMS.
LSI to Purchase Infineon Hard Drive Semiconductor Business
(March 10, 2008) Milpitas, CA — LSI Corp. today announced that it has signed a definitive agreement to acquire the assets and IP of the hard disk drive semiconductor (HDD) business of Infineon Technologies AG, including product designs, related software, inventory, and test equipment. Financial terms are not being disclosed.
SMTA Announces "Best of Conference" Award for Pan Pacific 2008 Symposium
(March 7, 2008) Minneapolis, MN — The SMTA has announced "Best of Conference Awards" to two presenters from this year's Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition, held in late January in Hawaii. These awards are chosen by attendee ratings.
Multitest Pick & Place Handler Delivered to European R&D Site
(March 7, 2008) Rosenheim, Germany — Multitest's MT2168 pick & place handler, which was introduced at SEMICON Europa 2007, has been delivered to its first customer. The MT2168 beta-site version was installed at an European R&D and production site of an international IDM.
FUJIFILM Dimatix, Agilent Collaborate on Inkjet Technology for Advanced Life Sciences
(March 7, 2008) Santa Clara, CA — FUJIFILM Dimatix Inc. today announced its collaboration with Agilent Technologies Inc. to supply the company with innovative inkjet products based on the latest semiconductor manufacturing technologies for use in life sciences applications. Agilent uses the FUJIFILM Dimatix inkjet technology to develop products that allow life scientists to more efficiently target and analyze sequences of genetic material.
Datacon, Ablestik Partner on Research and Evaluation for Advanced Epoxy Processes
(March 6, 2008) Radfeld, Austria & Rancho Dominguez, CA — Datacon and Ablestik have joined forces to provide joint technological development and shared product evaluations and demonstrations to the marketplace. The aim of this partnership is to strengthen technological leadership, especially in processes such as thin die and/or stacked die handling as well as other advanced epoxy processes, and to advise customers of both companies on the best solutions for their production needs.
From the Editor
When Life Gives You Lemons
(March 5, 2008) — Have you noticed lately that the doomsayers are out in full force? All the industry analyst reports — from Gartner, to SEMI, to SIA — are pointing to a slump in the industry, which, by the way, is expected to recover in 2009. The only difference in the news is that the forecasts keep being re-adjusted downwards. We get it already. Everyone is being cautious. Let's talk about something positive.
ELMOS, MagnaChip to Cooperate on Foundry Services
(March 4, 2008) Dortumund, Germany and Seoul, South Korea — ELMOS Semiconductor AG and MagnaChip Semiconductor Ltd. have signed a cooperation agreement regarding the development of automotive semiconductor technologies. In a second step, ELMOS will use the foundry services of MagnaChip for these automotive technologies, with MagnaChip delivering processed wafers to ELMOS.
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