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Industry News 2008 P18
Dow Corning, Indium, Others Receive Intel's PQS Award
(March 18, 2008) Midland, MI — Dow Corning Corp., Indium Corp., and 33 other companies were named recipients of Intel Corp.'s 2007 Preferred Quality Supplier (PQS) award for outstanding performance in providing products and services deemed essential to Intel's success. The PQS award winners will be honored at a celebration in Burlingame, CA, today.
Alchimer CEO Predicts Demise of Vapor Deposition Processes for TSVs by 2009
(March 17 2008) Massy, France — After being appointed CEO of Alchimer SA, Steve Lerner immediately predicted the demise of vapor deposition processes for depositing nanoscale films in through silicon vias (TSVs) within a year. Steve Lerner is a technologist with 29 years' experience in semiconductor development and manufacturing. He founded advanced packaging and device companies Alpha Szenszor, GigSys, and CS2, and has held executive positions at Amkor, Swire, and AME.
From the Editor
3D Integration, the Momentum Keeps Building
(March 19, 2008) — Even with industry-wide slowed economic growth, these are exciting times for the assembly, test, and packaging sector. We've been hearing it over and over for the past few years; and I heard it again from two presenters in the space of an hour at the IMAPS Global Business Council held Monday, March 17, in Scottsdale, AZ. Packaging is key to solving semiconductor issues in this consumer-driven marketplace.
Tessera Receives Job Development Investment Grant from North Carolina
(March 17, 2008) Charlotte, NC & San Jose, CA — The North Carolina Economic Investment Committee has awarded a job development investment grant (JDIG) to Tessera Technologies Inc., a provider of miniaturization technologies for the electronics industry. This grant will support Tessera's consumer optics plans, enabling the company to add 185 jobs and invest approximately $30 million in its Charlotte-based wafer-level optics facilities during the next five years.
Solder Ball Transfer for Flip Chip and WLCSP
By Andrew Strandjord, PacTech USA
(March 19, 2008) — Wafer bumping is often separated into two different categories: flip chip bumping and wafer-level chip scale packaging (WLCSP). This categorization and affiliated nomenclature is mainly based on solder bump size and the type of equipment used to create them. "Flip chip" refers to bumps on semiconductor wafers in the range of 50-200 µm in height. "WLCSP" refers to bumps that are in the range of 200-500 µm.
U.S. Computer Maker to Use Dow Corning Compound at China Facility
(March 14, 2008) Midland, MI — A U.S.-based personal computer maker has qualified Dow Corning's TC-5121 thermally conductive compound for use in its manufacturing operations in China. TC-5121, introduced in December, is designed for mid-range electronic systems such as desktop computers and graphic processing units.
Georgia Institute of Technology to Hold Nanopackaging Workshop April 15
(March 14, 2008) Atlanta, GA — The Georgia Institute of Technology (GIT) will be hosting the Industry-Academia Consortium Workshop on Nano Materials, Components, Packaging and Systems (NanoPack) on April 15, 2008, at the Microsystems Packaging Research Center at GIT in Atlanta, GA. For information and registration, go to www.prc.gatech.edu/events/nanopack.
Palomar Technologies to Discuss Microelectronic Services at iMAPS DP Conference
(March 12, 2008) Carlsbad, CA — Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, will discuss its microelectronic packaging services at the iMAPS International Conference and Exhibition on Device Packaging to be held in Scottsdale, AZ, on March 18 and 19. Palomar Technologies will be exhibiting in booth #66.
New CSP for Converters Offers Portable Systems Designers Space Savings
(March 12, 2008) Santa Clara, CA — Advanced Analogic Technologies Inc. (AnalogicTech), a developer of power management semiconductors for mobile consumer electronic devices, has made available chip scale packages (CSPs) for its AAT1149 and AAT1171 DC/DC converters. Bond wires are eliminated, offering a reduction in footprint.
Koh Young Opens Japan Sales, Service Division
(March 12, 2008) Seoul, South Korea — 3D inspection technology company Koh Young announces the establishment and opening of a sales and service division in Chiba, Japan, called Japan Koh Young Company Ltd. The branch has been established to better serve the evolving needs of the company's Japanese customers.
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