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Industry News 2008 P17
Aehr Test Systems Announces Acceptance of First FOX-15 System
(March 24, 2008) Fremont, CA — Aehr Test Systems has announced it has received customer acceptance on the first FOX-15 wafer-level burn-in system from a major automotive IC manufacturer. Revenue for this system will be recognized in fiscal 4Q08.
CoorsTek Releases Revised Design Guide for Thick-Film Ceramic Substrates
(March 21, 2008) Grand Junction, CO — CoorsTek has released the latest version of its design guide for thick-film ceramic substrates. The first significant update in several years, this guide offers electronics engineers the latest design guidelines for standard thick-film and laser machined ceramic substrates.
Agilent's New Cover-Extend Technology Eliminates Need for Physical Test Points for ICT
(March 21, 2008) Santa Clara, CA — Agilent Technologies Inc. has unveiled a limited access solution for In-Circuit Test (ICT) users that eliminates the need for physical test points, offering benefits that traditional VTEP test cannot provide. Part of Agilent's VTEP v2.0 Powered test suite, the Agilent Cover-Extend Technology is a hybrid between two established test methodologies in the electronic manufacturing industry: Boundary Scan and VTEP Vectorless Test.
STATS ChipPAC Introduces New Design Library
(March 20, 2008) — STATS ChipPAC Ltd. has announced a new IPD Products Databook which contains a library of silicon-based integrated passive device (IPD) designs to assist semiconductor companies in reducing design cycle time and increasing integration options in radio frequency (RF) applications.
STS Receives Order for DRIE Tool from TU Dresden
(March 20, 2008) Newport, Wales, UK — Surface Technology Systems plc (STS) has announced that they have sold a Pegasus deep reactive ion etch (DRIE) tool to the Institut für Halbleiter- und Mikrosystemtechnik (IHM, or Semiconductor & Microsystems Technology Lab.), part of the Technische Universität Dresden. The lab will be using STS' DRIE technology in the development of advanced packaging solutions, in particular investigating the use of through-wafer vias for 3D-IC interconnects.
NA Semi Equipment Industry Posts February B-to-B Ratio of 0.93
(March 19, 2008) San Jose, CA — North American-based manufacturers of semiconductor equipment posted $1.23 billion in orders in February 2008 (three-month average basis) and a book-to-bill ratio of 0.93, according to SEMI's February 2008 Book-to-Bill Report published today. A book-to-bill of 0.93 means that $93 worth of orders were received for every $100 of product billed for the month.
K&S Celebrates Next Gen Wire Bonders at SEMICON China
By Gail Flower, Editor-in-Chief
(March 18, 2008) SHANGHAI — Fort Washington, PA-based Kulicke & Soffa Industries, Inc. launched two next-generation wire bonders just after SEMICON China opened for public viewing. Representatives from the Chinese government and from SEMICON China gave welcoming speeches, as did Christian Rheault, senior VP equipment segment of K&S.
The Riley Report
Nanotechnology: Dead or Alive?
By George A. Riley, Contributing Editor
(March 19, 2008) — Like a view of the Grand Canyon, your view of nanotechnology depends upon where you stand. From the casino world of venture capital, the prevailing view appears to be that nanotechnology is not a winner. Billions of research dollars, millions of favorable words, thousands of proposals, hundreds of startups – yet not a single public stock offering (IPO).
Tessera Introduces its MVP
(March 19, 2008) SAN JOSE, CA — Whether the acronym stands for micro via package or most valuable package, it looks like Shellcase MVP, introduced yesterday by Tessera Technologies, will answer to both. This recent addition to the SHELLCASE family is reportedly one of the industry's first applications of through silicon via (TSV) technologies and supports 3D die-stacking of the image sensor with other ICs.
Intel Honors 13 Companies with Supplier Quality Awards
(March 19, 2008) Santa Clara, CA — Intel Corp. has named the 13 winners of the company's most prestigious award for suppliers: the Supplier Continuous Quality Improvement (SCQI) award. The honor, bestowed for outstanding commitment to quality and performance excellence in 2007, recognizes companies that provided products and services deemed essential to Intel's business success.
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