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Industry News 2008 P16
Illinois Toolworks Inc. Acuires Vitronics Soltec
(March 28, 2008) Glennview, IL — Illinois Tool Works Inc. announced the aquisition of all outstanding shares of VS Acquisition Holding Inc., the parent company of Vitronics Soltec Corporation, manufacturer of equipment, software, and related services used in soldering of semiconductor device packaging, and PCBs. Terms of the transaction were not disclosed.
ESI Receives Multiple-system Order for TFOS Laser-trimming Systems
(March 27, 2008) Portland, OR — Electro Scientific Industries Inc. has announced that it has received a multiple-system order from a leading North American analog IC manufacturer for its model 2100 thin-film-on-silicon (TFOS) laser-trimming system. The 2100 TFOS systems will be used to expand production capacity at this customer's North American facility.
New Analysis Estimates MEMS Market to Reach $120.2M in 2014
(March 27, 2008) PALO ALTO, CA — If the MEMS test equipment market is to match the pace of the overall MEMS market, it has to develop cost-effective, standardized solutions. This is especially pertinent in a market where expensive customized products vastly outnumber off-the-shelf products. New analysis from Frost & Sullivan "World MEMS Test Equipment Markets," finds that the market earned revenues of $56.5M in 2007 and estimates this to reach $120.2M in 2014.
Asymtek Offers Tips for Improving Dispensing and Conformal Coating
(March 27, 2008) Carlsbad, CA — Asymtek, a Nordson company, will feature in-booth presentations about conformal coating and scalable dispensing solutions at APEX 2008, held at the Mandalay Bay in Las Vegas, NV from April 1-3. The presentations will offer tips for improving manufacturing processes and total cost of ownership.
STATS ChipPAC Appoints Chief Sales Officer
(March 26, 2008) Singapore — STATS ChipPAC Ltd. today announced the appointment of Hal Lasky as executive vice president and chief sales officer for the company effective March 27. Based in the US, Lasky will report directly to Tan Lay Koon, STATS ChipPAC's president and CEO, and will have overall responsibility for the STATS ChipPAC's worldwide sales and product line management organization.
SMART Modular Adds Dynamic Burn-In to Its Testing Process and Teams With Aehr Test
(March 26, 2008) Fremont, CA — SMART Modular Technologies Inc. (SMART) has announced it has added test during burn-in (TDBI) to its enterprise class memory (ECM) testing process. SMART's new TDBI procedure applies functional patterns, temperature, and voltage for screening or eliminating marginal DRAM devices, which can cause time and stress dependent failures. Without this level of burn-in, these flaws could result in early lifetime failures for the memory device.
Numetrics Unveils ERP Software & Signs Agreement with NXP
(March 25, 2008) CUPERTINO, CA — Numetrics Management Systems Inc. has announced its NMX-ERP 3.0 suite of enterprise resource planning (ERP) software for IC development organizations that extends the company's top-down project planning and risk measurement capabilities, handling chips designed in nodes down to 45 nm. In addition, Numetrics has made a 3-year, multimillion Euro agreement with NXP Semiconductors to license Numetrics' NMX-ERP software suite and professional services.
SEMI Reports 2007 Global Semiconductor Equipment Sales of $42.77B
(March 25, 2008) San Jose, CA — SEMI has reported that worldwide sales of semiconductor manufacturing equipment totaled $42.77 B in 2007, representing a year-over-year increase of 6%. The data is available in the Worldwide Semiconductor Equipment Market Statistics (SEMS) Report, now available from SEMI.
Sonoscan Introduces Acoustic Profiling Module
(March 25, 2008) Elk Grove Village, IL — Sonoscan has introduced a new capability for its line of C-SAM acoustic microscopes that reveals the external surface topography of a device at the same time as its internal features. Known as the acoustic surface profile (ASP) module, this important mode can be used to measure warpage of plastic integrated circuits, flip chips, substrates, circuit boards
Watlow On-off Temperature and Limit Controllers Now RoHS Compliant
(March 24, 2008) St. Louis, MO — Watlow has announced that its on-off temperature and limit controllers are now compliant with the European Reduction of Hazardous Substances (RoHS) directive (2002-95-EC). Watlow's on-off line of products include the Series CV, LV, CF, LF and TM controllers. These controllers are now compliant by design rather than by exception to the RoHS directive. This means Watlow uses components that meet hazardous material restrictions in the directive.
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