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Industry News 2008 P15
Henkel Aquires Ablestik, Emerson Cuming
(April 3, 2008) Las Vegas — Henkel Corp. announced the aquisition of Ablestik and Emerson & Cuming, the adhesives group of National Starch, for approximately $6 billion. The companies will become part of Henkel's adhesives group, bringing in die attach, board-level interconnect, and related materials, along with intellectual property (IP) and a global manufacturing base. FULL STORY.
Aviza Restructures; Leverages Core Technologies for 3D-IC
(April 4, 2008) Scotts Valley, CA — Aviza Technology, Inc. supplier of advanced semiconductor capital equipment and process technologies announced restructuring plans intended to focus its core strengths in ALD technology for the sub-45nm nodes, and etch and PVD technologies for the fast growing 3D-IC market segments. Aviza reportedly believes it has competitive advantages as demonstrated by recent wins for ALD in Japan, Etch for MEMS devices and PVD for power ICs.
Tessera Acquires IP Rights from Kronos
(April 4, 2008) San Jose, CA and Belmont, MA— Tessera Technologies, Inc. provider of miniaturization technologies for the electronics industry, and Kronos Advanced Technologies, Inc. developer of ionic- based products and technologies for air movement and purification, announced the sale and licensing of certain intellectual property (IP) rights related to Kronos proprietary technologies to Tessera.
Thoughts on the News
Numerically Speaking
By Jeffrey C. Demmin, contributing editor
The semiconductor industry is certainly a complicated one. The complex technology, fast pace of change, its global nature, constantly evolving segmentation, and many other factors all create challenges for understanding what is really going on. It is easy, therefore, for all of us to fall back on a few key indicators to help keep track of it. Let's look at a few numbers that have appeared in the press lately.
3D Packaging Technologies Steal the Show at IMAPS
By Françoise von Trapp, managing editor
If the overflow of registered attendees standing in the hallway, craning their necks to hear what was being said inside the room was any indication, than the primary technology draw at this year's IMAPS International Device Packaging Symposium was anything to do with 3D packaging technologies; and through silicon via (TSV) processes were clearly stars of the show.
Semiconductor Materials Post Record Revenues
(April 1, 2008) SAN JOSE, CA — The global semiconductor materials market grew 14% in 2007 and is forecasted to grow over 11% in 2008 according to the latest materials forecast from SEMI. While the semiconductor industry grew 3% in 2007 to reach the $256B published by the Semiconductor Industry Association (SIA), the global semiconductor materials market grew 14% in 2007 to reach a record $42 billion.
From the Editor
Six Degrees of Separation
Two weeks ago, I was in Scottsdale AZ, simultaneously attending the IMAPS Device Packaging Symposium, assembling an issue of AP Semi-monthly and putting the finishing touches on the April issue of Advanced Packaging. Chaotic though it may sound, there was actually a synchronous tone to the whole process.
DuPont Microcircuit Materials Highlights Developments at Printed Electronics Europe
(April 1, 2008) BRISTOL, U.K. — As part of DuPont Microcircuit Materials' (MCM) participation at IDTechEx Printed Electronics Europe, which focuses on thin film and organic electronics, Kerry Adams, Ph.D, market development lead, DuPont, will discuss the company's developments in inks and imaging for printed electronics. The event will be held at Maritim Hotel and Congress Centre in Dresden, Germany on April 8 – 9, 2008.
The 3DASSM Consortium: An Industry/Academia Collaboration
By Ritwik Chatterjee, Ph.D. and Rao Tummala, Ph.D., Georgia Tech
Ceramic substrates were the basis of high performance IC packages until 1990. Since then organic substrates have taken over. However, organic substrates seem to have reached their limits. Recent advancements using Si wafer as the substrate with through-silicon via (TSV) replacing flip chip and wire bond, and with embedded thin-film components, may allow for part or the entire system to be made of silicon.
Dage High-speed Bondtester Complies with JEDEC Standards
(March 28, 2008) Freemont, CA — Dage Precision Industries, a Nordson company, announced that it's 4000HS High-speed bondtester is the first of its kind to comply with the recently published JEDEC standards for high-speed bondtesting.
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