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Industry News 2008 P14
BiTS Workshop: A Success Story
By Gail Flower, editor-in-chief
The ninth annual Burn-in and Test Socket Workshop (BiTS 2008) on March 9-12, 2008 in Mesa, AZ, presented an interactive, growing, and technical successful forum for experts dedicated to sharing knowledge. BiTS brought together 350 conference attendees and 60 exhibitors worldwide from users of sockets, boards, burn-in systems, handlers, packaging engineers, and suppliers to the industry.
The World Is 3D, Why Aren't Our Design Tools?
By Josephus van Kuijk, Ph.D., Coventor, Inc.
For years now, companies that offer mechanical computer-aided design (CAD) solutions have emphasized the use of 3D CAD tools. While progress has been uneven, we can reasonably say that the transition has been accomplished in the mechanical area, first from paper-based technical drawings to 2D computer-based drawings, and now to 3D CAD systems.
MEMS Accelerometers Find Multiple Applications
(April 10, 2008) Scottsdale, AZ — - MEMS accelerometers have hit the limelight with all the consumer applications in gaming devices, such as the Nintendo Wii, and smart phones like Apple's iPhone. But these popular products are only the high-profile advance wave of what will be a rising tide of new and innovative uses for the tiny motion sensors, says Douglas McEuen, senior analyst at ABI Research.
Datacon Technology Joins EMC-3D Consortium
(April 9, 2008) Radfeld, AUSTRIA — EMC3D, an international semiconductor equipment and materials consortium dedicated to the cost-effective development of 3D through silicon via (TSV) interconnects, announced the addition of Datacon Technology to the organization. Datacon, manufacturer of die bonding & sorting equipment will provide high-precision assembly expertise to the consortium.
Georgia Tech To Hold 2nd Nanopack Consortium Workshop
(April 9. 2008) Atlanta, GA — The Microsystems Packaging Research Center at Georgia Tech will hold its workshop to introduce its global industry-academia consortium on "Nano Packaging, Materials, Components & Systems (NanoPack)" on Tuesday, April 15, 2008. The purpose of NanoPack is to investigate going beyond nano materials and devices to form system level components leading to nano modules.
Vectron International to Host Energy Fair
(April 9, 2008) Hudson, NH— Vectron International, producer of frequency control, sensor, and hybrid product solutions, will partner with Public Service of New Hampshire (PSNH) to host an Energy Fair for Vectron employees and the general public at its Hudson facility on Tuesday, April 15 from 10:00 a.m. – 3:00 p.m. EST. Attendees of this free event will gain insight into corporate initiatives regarding the creation of a "green" organization.
ESI Receives Multi-system Order from Hangzhou Silan Azure Corp.
(April 8, 2008) San Jose, CA — ESI announced that its New Wave Research (NWR) Division has received a multiple system order from Hangzhou Silan Azure Corp., Ltd. for its AccuScribe 2112 laser-scribing equipment. China-based Silan Azure— manufacturer of full-color LED chips — will reportedly use the systems to expand production capacity for its high-volume, HB-LED applications.
SUSS Installs First 300-mm WLR Test System
(April 8, 2008) Yokohama, JAPAN — SUSS MicroTec AG announced the first installation of its PM300WLR, said to be the world's first dedicated 300-mm wafer-level reliability (WLR) test system, at a leading Japanese semiconductor device manufacturer. According to the company, it will be used for testing the reliability of current and next-generation devices.
Xilinx Introduces Large Capacity FPGAs for Space Applications
April 7, 2008 (San Jose, CA) — Xilinx, Inc., provider of programmable solutions and field programmable gate arrays (FPGAs) for the aerospace and defense industry introduced a reprogrammable, radiation-tolerant Virtex-4QV family optimized for high-performance logic, DSP, and embedded processing.
Avago Technologies Leverages Chip Scale Packaging Innovation
(April 7, 2008) San Jose, CA — Avago Technologies announced an innovative chip scale packaging technology which is said to enable miniaturization of transistors with high-frequency operation and superior thermal dissipation. Reportedly measuring a mere 1.0 × 0.5 × 0.25 mm, these field effect transistors (FET) — ultra-small, low-profile discrete low noise devices — occupy less than 5% the volume of a standard SOT-343 package.
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