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Industry News 2008 P13
Palomar Technologies Triples Cleanroom Capacity for Microelectronics Assembly Services
(April 17, 2008) Carlsbad, CA — Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, announces the expansion of its cleanroom assembly area for Palomar Microelectronics assembly services. Palomar has reportedly tripled its cleanroom space and increased its prototyping, applications engineering, process development, assembly, and test services capabilities.
Teradyne to Equip Bosch Automotive Test Facilities
(April 17, 2008) North Reading, MA — Teradyne, Inc. announced that their FLEX Test Platform has been selected by Bosch to equip their automotive test facilities for future projects. The selection, spanning multiple years, was the result of a 10-month evaluation process that examined all automatic test equipment (ATE) suppliers. The evaluation reportedly included a variety of functions within each company as well as tester performance.
Jordan Valley Acquires Assets of Semiconductor Equipment Supplier Bede
(April 16, 2008) Migdal Ha'Emek, ISRAEL — Jordan Valley Semiconductors LTD, a provider of semiconductor metrology solutions, has acquired the business of Bede, effective Monday April 14th. Bede is a supplier of high-resolution XRD (HRXRD) metrology for the semiconductor and compound industries with revenues of $11.6M in 2007. Bede entered into the UK's Administration phase, their equivalent of Chapter 11, on March 31.
STMicroelectronics Introduces High-performance MEMS Motion Sensors
(April 15, 2008) GENEVA — STMocroelectronics, a supplier of the MEMS devices found in many gaming and mobile multimedia applications, announced the addition of two accelerometers to its ultra-compact portfolio of devices in 4 × 4 × 1.5 mm LGA packages, with full-scale range selectable between ±2g, or ±6g for super-small applications requiring high performance.
SEMICON Singapore Targets Assembly, Test and Packaging
(April 15, 2008) SINGAPORE — SEMI is gearing up for the SEMICON Singapore, which takes place May 5-7, 2008 at the Suntec Singapore International Convention and Exhibition Centre. Southeast Asia is reportedly the leading region for test, assembly and packaging (TAP), so the event is expected to draw global semiconductor manufacturing executives from that sector of the industry.
ASAT Announces Executive Changes
(April 14, 2008) Hong Kong and Milpitas, CA — Global semiconductor assembly, test and packaging provider, ASAT Holdings, LTD. announced the appointment of Jeffrey Omun in the newly created position of president, effective immediately. In addition, Osmun will reportedly assume the title of executive V.P. of sales and marketing, assuming responsibility for the company's worldwide sales organization. Osmun will be based in the U.S. and report to Tung Lok Li, ASAT's acting CEO.
From the Editor
Recognizing Achievement
My mother is an amazing woman. On April 25 she'll celebrate her 81st birthday. She still lives alone in the house I grew up in — a 250 year-old 12 room colonial — cooking her own meals and hosting her monthly ladies group. The most remarkable part is that for the past 59 years, she's been confined to a wheelchair after surviving polio 10 days after the birth of my oldest sister, her second child.
SEMICON China Expanding
By Gail Flower, editor-in-chief
On March 18-19 2008, a constant stream of visitors flowed in to SEMICON China, held in the Shanghai New International Expo Centre, to attend grand new product introductions and educational forums that addressed the latest in growth areas for electronics. What a clip of activity surrounded the conference. All of the familiar players were there doing business.
The Riley Report
ENIG Moves Upscale
By George A. Riley, Ph.D., contributing editor
Electroless nickel/immersion gold (ENIG) has come a long way as a UBM since I first saw it in the early 1990's – three beakers in a fume hood at Fraunhofer IZM. Our continuing industry shift towards copper metallization and lead-free solders has opened new opportunities for electroless UBM, attracting new suppliers and formulations.
Proactive Thermal Planning
By Patrick Carrier, Mentor Graphics
In recent years, long-ignored thermal issues have been wreaking havoc on electronic systems' reliability. Anyone who has opened a computer case and seen the massive, often elaborate heatsinks attached to microprocessors knows how severe thermal issues can be. A more proactive approach, applying various methodologies, is the only solution for successfully designing complex electronic systems to meet thermal requirements.
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