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Industry News 2008 P11
Flip Chip Goes 3D
By Daniel F. Baldwin, Ph.D. and Paul Houston, ENGENT, Inc.
With advances in wafer-thinning technology, 3D packaging now provides a robust platform for achieving high levels of integration, small package footprints, and thin package profiles. Further component miniaturization with the added benefit of 3D integration can be realized by face-to-face bonding of fine-pitch flip chip components and low-profile passives onto a redistribution layer (RDL) of another silicon component.
Thoughts on the News
The Return of Vertical Integration
By Jeffrey C. Demmin, contributing editor
Many industries seem to oscillate between focusing on core competencies, and trying to grow businesses by expanding into new areas. Some recent developments during the current relative lull in the semiconductor industry indicate that many leading firms are choosing the latter — looking for new growth opportunities by broadening their scope.
Oerlikon Esec Introduces Product Family at SEMICON Singapore
(May 5, 2008) Cham, Switzerland and Singapore — Oerlikon Esec, provider of automated chip assembly equipment and system solutions for the semiconductor industry, formally introduced the introductory platform of an entirely new product family at an official unveiling during SEMICON Singapore. The Die Bonder 2100 xP targets the high-volume epoxy die attach market.
Ken Joyce Named President of Amkor Technology
(May 5, 2008) Chandler, AZ — Amkor Technology, Inc. announced that Ken Joyce has been appointed President of the company. Joyce, 61, will also continue as COO and will report to James Kim, Chairman and CEO. Joyce joined Amkor in 1997 and was CFO for more than 8 years before becoming Chief Administrative Officer in November 2007 and Chief Operating Officer in February 2008.
From The Editor
Meetings of the Minds
We learn a lot by observing others and listening to their ideas. It's easy to become myopic when we work alone. When we're required to look beyond the boundaries of our scope of knowledge to consider what our peers have to say, that's when real discoveries happen. This is one observation I've made from participating in technical symposiums and conferences. There's only so much you can learn from sitting in your cubicle or office.
IPC, Jisso Sponsor Advanced Interconnect Seminar
(May 1, 2008) Bannockburn, IL. — IPC — and the Jisso International Council (JIC) are sponsoring a technical seminar, "Implementing Advanced Interconnect Technology Solutions," May 21–22, 2008, in Atlanta. Hosted by Georgia Institute of Technology, the event will provide information on the latest trends in interconnection technologies, led by speakers from JIC and the industry.
TI CEO Inspires Engineering Students
(May 1, 2008) Urbana, IL — During a distinguished lecture, held Wednesday, April 30, 2008 at the University of Illinois to commemorate the 50th anniversary of the IC, Rich Templeton, chairman, CEO and president of Texas Instruments (TI), addressed students and faculty, encouraging them that following in the footsteps of Jack Kilby, designer of the world's first IC, gives them the potential to solve some of the world's most critical problems.
University of Michigan Team Receives Grant to Research Electronics Heat Management
(April 30, 2008) Ann Arbor MI — A team led by a University of Michigan mechanical engineer has received a five-year, $6.8-million grant from the Air Force to examine heat management issues in the spectrum of electronic devices from jet engines to personal electronics to nano-scale transistors.
Collaboration is the Theme at the 2008 Global STC Conference
(April 30, 2008) Niwot, CO — "Collaborative Solutions Beyond 2010" is theme of this year's Global STC Conference, organized by the Semiconductor Test Consortium, Inc. (STC). This interactive global forum, open to both STC member and non-members, will be held on June 4-6, 2008 in San Diego, California.
Tessera Licenses SHELLCASE MVP Technology to Nemotek
(April 29, 2008) San Jose, CA — – Tessera Technologies and Nemotek S.A. announced that Nemotek has licensed Tessera's SHELLCASE MVP wafer-level chip-scale packaging (WLCSP). SHELLCASE MVP is the latest member of Tessera's image sensor CSP family, and is reportedly the industry's first to implement through silicon via (TSV) processes.
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