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New Products 2007 P1
Next-generation X-ray Metrology Platform
The 3-channel 6200 platform, based on rapid, non-contacting, and non-destructive X-ray technology, has been in use for various thin film measurement applications in high volume semiconductor fabs worldwide for several years.
Underfill Material for BGA and CSP Devices
The Loctite 3508 one-component epoxy is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system. Unlike capillary flow underfills that require dedicated equipment and subsequent process steps, this epoxy can be applied in-line with existing capital equipment with curing taking place during the normal solder reflow process.
Wafer Probe Card
The TrueScale PP40 wafer probe card is designed to enable high-efficiency and high parallelism wafer probing on advanced wire bond logic and SoC devices. By supporting pad pitches down to 40 microns, this probe card allows IC manufacturers to shrink the size of their test pads, enabling some users to retain a single-row pad layout.
Thermally Conductive Compound
The TC-5121 thermally conductive compound is designed for mid-range electronic systems, such as desktop computers and graphic processing units. The new compound reportedly provides a formula less likely than other thermal materials to scratch heat-sink lids.
Scalable Dispensing Platform
The Spectrum S-920 series of scalable dispensing platforms adapts to the needs and requirements of high-volume microelectronics manufacturing and PCB assembly such as flip chip and CSP underfill. The platforms feature technologically advanced and integrated software and hardware control based on Fluidmove XP software with process control features.
High force device bonder with nanoimprint capabilities
The FC300 high-force (4000N), high accuracy (0.5µm) device bonder for wafer diameters up to 300mm is the first step in a joint development program between CEA Leti and S.E.T.
Machine Micro Lenses
The HR65D-VI series of machine micro lenses (MMLs) has been designed for high-resolution discrete part inspection in semiconductor manufacturing operations including die bonding, flip chip bonding, chip on glass and chip on film machining.
Design-to-Verification Software
The HDL (hardware description language) Designer series has been extended to provide a platform for implementing SystemVerilog. The HDL Designer Series with SystemVerilog provides a unified environment for all HDLs, while taming the complexity of object-oriented programming.
Wafer Scale Bump Inspection System
The IBIS-Versalea is a new bump inspection system aimed at silicon wafer bump inspection. IBIS uses conventional interferometry combined with massive parallel data processing to give a production scale inspection tool capable of inspecting and reporting on 3000 bumps/sec.
AlSiC Metal-matrix Composite for Base Plates
AlSiC (aluminum silicon carbide) is a metal-matrix composite suited for base plates material for insulated gate bipolar transistors (IGBT) used in high-power traction, power control, hybrid electric vehicle power systems, and fly-by-wire applications.
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