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Industry News 2007 P35
ECTC Paper Presentation Preview
(May 23, 2007) RENO, NV — The 57th annual Electronic Components and Technology Conference (ECTC), May 29 to June 1 in Reno, NV, will feature developments in packaging, components, and microelectronic systems technology. Paper presentations include four technical pieces from Endicott Interconnect (EI — Endicott, NY) and five by Freescale Semiconductor (Austin, TX).
FETtest Completes Amicronix Buy
(May 23, 2007) MORGAN HILL, CA — FETtest, Inc., acquired Amicronix, Inc. (San Jose, CA), adding production mixed-signal semiconductor test equipment to its product portfolio.
SEMI Reports Q'01 Shipments Rising
(May 22, 2007) SAN JOSE, CA — SEMI reported that Q'01 bookings worldwide for semiconductor manufacturing equipment rose about 6% in 2007 over 2006; billings rose approximately 12% over the same quarter last year. Billings increased significantly in Korea, China, and Taiwan.
Avago Cuts Manufacturing in Strategic Shift
(May 21, 2007) SAN JOSE, Calif. — Avago Technologies expanded its manufacturing outsourcing program as part of a business model shift announced in January 2007. The component supplier will reduce its Singapore manufacturing staff by about 230 people to allot resources to higher value-added activities.
Temasek Increases STATS ChipPAC Holdings
(May 21, 2007) SINGAPORE — Singapore Technologies Semiconductors Pte Ltd., wholly owned subsidiary of Temasek Holdings Limited, closed its voluntary conditional cash offer for STATS ChipPAC shares and convertible notes by increasing its holdings to 83.1%.
Sonoscan Investigates Air and Fluid Contamination
(May 18, 2007) ELK GROVE Village, IL — Sonoscan determined that some delaminations in plastic IC packages contain air and fluid contaminants, possibly caused by silicone used as a release agent in molding equipment. Acoustic microscopic imaging identified partly red and partly white delaminations on plastic-encapsulated microcircuits, which indicated two types of contaminants.
Smart Phones to Drive Mobile Chips Market
(May 17, 2007) BEIJING — The Semiconductor Industry Research Center of CCID Consulting reports that mobile phone production in China experienced typically slow growth in Q'01 2007 from Q'04 2006, but overall grew 45.7% in 2006. The mobile phone chip market did not slow as much as mobile phone production, due in part to the increasing prevalence of smart phones.
Nanocomp Celebrates CNT Textiles
(May 16, 2007) CONCORD, NH — It looks like cotton candy as its being synthesized, but has the strength of carbon steel. It is as electrically conductive as copper at 50MHz and is thermally conductive. It has application possibilities across military, aerospace, and semiconductor markets. Is it any wonder that Nanocomp Technologies, the company that manufactures this carbon nanotube (CNT) textile, received the New Hampshire High Tech Council's "Product of the Year" in 2006?
STATS ChipPAC Builds R&D for Packaging Technologies
(May 16, 2007) SINGAPORE — STATS ChipPAC Ltd. will establish a Singapore R&D facility for through-silicon via (TSV), microbumping, die embedding, and advanced substrate technologies to create advanced packages. Core operations will focus on wafer-level processing and advanced wafer integration.
Amkor, UTAC to Cross-license Packaging
(May 15, 2007) CHANDLER, AZ and SINGAPORE — Amkor Technology, Inc. (Chandler), and United Test and Assembly Center Ltd. (UTAC — Singapore) entered a multi-year cross-licensing agreement wherein UTAC will adopt Amkor's MLF technology and Amkor will use UTAC's QFN patents. The deal covers intellectual property rights (IPR) and transfer of associated packaging technologies.
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