Web Exclusive Articles
New Products |
Industry News |
Archives Home
Industry News 2007 P17
Gartner: Outsourcing Hits Packaging Sector
By James Montgomery, contributing editor
(September 12, 2007) DANBURY, CT — Global PAT revenues are expected to grow at half the rate in 2007 that they did in 2006, and will improve marginally in 2008, according to new data from Gartner Dataquest. A closer look inside the numbers reveals the emergence of outsourced SATS providers, poised to balloon by nearly a third over the next three years and reach equal footing with IDMs.
Emerging MEMS Manufacturers Look Beyond Auto Apps
(September 12, 2007) PHOENIX — The MEMS market is an attractive area to operate in, according to Semiconductor Partners, because MEMS revenue will double from $5B in 2005 to $10B in 2011. "Driving MEMS Beyond Automotive," suggests that a "select group of large, well-established MEMS suppliers" will benefit from growth in the automotive sector, while "new, emerging entrants" to the MEMS market will capitalize on opportunities in consumer, communications, and portable product sectors.
White Paper Details Urethane Potting Technology
(September 11, 2007) CRANSTON, RI — Epoxies Etc... released "New Urethane Technology for Potting & Encapsulation in Electronics," targeting assemblers potting components for use in harsh environments, such as aerospace, automotive, and marine industries.
Rohm and Haas Orders SUSS' Coat/Develop Cluster
(September 11, 2007) MUNICH, Germany — SUSS MicroTec will install the first Famma XPress coating and developing cluster tool at Rohm and Haas' photoresist manufacturing site in Nigata, Japan. Rohm and Haas will develop, characterize, and optimize photodielectrics, and thick- and thin-film photoresists on the Gamma tool.
tMt Installs Alcatel DRIE Tool for MEMS Fab
(September 10, 2007) TAIPEI, Taiwan — Alcatel Micro Machining Systems (Annecy, France) shipped an advanced deep reactive ion etch (DRIE) production tool to Touch Micro-system Technology (tMt — Yang-Mei, Taoyuan, Taiwan), allowing the MEMS foundry to begin producing advanced MEMS devices, including micro mirrors, silicon microphones, and gyroscopes.
Electronics Largest Nanomaterial Market Near-term
(September 7, 2007) CLEVELAND — Nanomaterials have established a $1B market, primarily for use in electronics production, according to "World Nanomaterials," from the Freedonia Group, Inc. The report suggests that more conventional uses — wafer-polishing slurries or reinforced plastic composites — still consume the volume of nanomaterials, but novel materials — nanotubes and dendrimers — will grow in popularity over the coming 10–20 years.
Automotive LED Manufacturer Selects Henkel Materials
(September 7, 2007) IRVINE, CA — Grote Industries selected a custom-formulated Hysol potting compound from Henkel to enable full automation at its 1-million-parts per year LED lamp assembly line. The compound met 19 engineering requirements for environmental friendliness, thermal conductivity, reliability, and other criteria, and will be deployed for use across 10 product families.
Cobar Group Becomes Part of Balver Zinn
(September 6, 2007) BALVE, Germany and BREDA, Holland — The Cobar Group BV became part of Balver Zinn with the final full transfer of ownership, following a signed Letter of Intent to merge in March 2007. Balvar Zinn Group focuses on the metallurgy of solder materials and non-ferrous metals. Cobar will lead the future development of solder paste, flux, and other related materials.
ASE, Mitsui Collaborate for Hybrid Packaging
(September 6, 2007) SANTA CLARA, CA — Advanced Semiconductor Engineering Inc. (ASE) and Mitsui High-tec Inc. signed a multi-year cross-licensing agreement to design and make hybrid manufacturing technologies (HMT), with each side sharing IP rights and technical expertise. The deal centers on Mitsui's HMT technology, a JEDEC/JEITA standards-conforming, copper leadframe-based area array package that offers a reportedly more flexible footprint than a multi-row QFN.
U.S. IDM Installs Olympus Wafer Inspection System
(September 6, 2007) SAN JOSE, CA — Olympus Integrated Technologies America (Olympus-ITA), a subsidiary of Olympus Corporation of Japan, completed sale of its Model AL3300 wafer inspection and defect review system to a U.S.-based integrated device manufacturer (IDM). The company will use the AL3300 to inspect tops, edges, and back-sides of 300-mm wafers for bad coats, hot spots, scratches, and contamination.
PAGE:
1 |
2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
10 |
11 |
12 |
13 |
14 |
15 |
16 |
17 | 18 |
19 |
20 |
21 |
22 |
23 |
24 |
25 |
26 |
27 |
28 |
29 |
30 |
31 |
32 |
33 |
34 |
35 |
36 |
37 |
38 |
39 |
40 |
41 |
42 |
43 |
44 |
45 |
46 |
47 |
48 |
49 |
50 |
51 |
52 |
53 |
54 |
55 |
|
|
|
|
Search Articles
Advanced Search
|
Web Exclusives 