Web Exclusive Articles
New Products |
Industry News |
Archives Home
Industry News 2007 P1
Carsem Offers Strip Test for Sawn MLPs
(December 27, 2007) SCOTTS VALLEY, CA — Carsem, a provider of turnkey packaging and test services to the semiconductor industry, announced the availability of strip testing services for their sawn micro leadframe package (MLP) family.
Elcoteq Reorganizes to Become Customer-centric
(December 27, 2007) HONG KONG — Beginning January 1, 2008, Elcoteq, an electronics manufacturing services (EMS) company with original design manufacturing (ODM) capabilities in the communications technology field, announced it will proceed with the action plan set forth in October, 2007, to streamline and simplify its organization. The company's goal is to improve response time to its customers' developing needs in all business areas.
Semiconductor Execs Expect Moderate Revenue Growth to Negatively Impact Profitability
(December 21, 2007) MOUNTAIN VIEW, CA — Semiconductor executives anticipate moderate revenue growth, below historical averages, in the coming year, and, profitability is expected to be volatile over the next five years, according to a recent global survey of semiconductor company executives conducted by KPMG LLP, the US audit, tax and advisory firm. Executives als expect competition in emerging markets, manufacturing and product innovation to lead to increased M&A activity.
ESI Receives Multiple-system Orders from Promos
(December 19, 2007) PORTLAND, OR — Electro Scientific Industries Inc. has announced that ProMOS Technologies has placed a multiple-system order for its model 9830HDE link processing tool. The tool features a high-throughput, 100-kHz laser and high-velocity stage, and is compatible with ProMOS' existing installed base of ESI 9830 laser systems.
Besi Restructuring Focuses on Integration of Sales and Services
(December 20, 2007) DUIVEN, The Netherlands
— The restructuring of BE Semiconductor Industries N.V. (Besi), completed this fall, focuses on the centralization of certain global developing, manufacturing, sales, and service activities in order to streamline processes, reduce overhead in the subsidiaries, and improve profitability. The new organizational structure should also facilitate the designing of shared system platforms.
Rudolph to Acquire Applied Precision's Semiconductor Business
(December 20, 2007) FLANDERS, NJ — Rudolph Technologies Inc. has signed an agreement to acquire the net assets of the semiconductor business of Applied Precision LLC, a provider of precision wafer probe card metrology systems and wafer probe process management systems to semiconductor final manufacturing facilities. Applied Precision will become part of Rudolph's newly-formed Probe Card Test and Analysis Division.
Polymer Vision Participates in Holst Centre Open-Innovation Program
(December 18, 2007) EINDHOVEN, The Netherlands — The Dutch rollable display company Polymer Vision has joined the Holst Centre, an initiative of the Flemish and Dutch research centers IMEC and TNO. During the partnership, Polymer Vision will research and develop organic transistor technology and patterning processes in the open-innovation setting of Holst Centre, collaborating with other researchers from other companies joining the program.
Chunghwa Picture Tubes to Enter LED Market
(December 17, 2007) TAIPEI, Taiwan — In line with the increasing use of LED backlight modules in display applications, Chunghwa Picture Tubes Ltd. (CPT) reportedly plans to step into upstream LED manufacturing, according to industry sources, reported CENS. CPT reportedly plans to have its affiliated Sintronic Technology Inc. take charge of LED packaging, and San Chih Semiconductor Co., Ltd. will be responsible for LED epitaxy.
Amtech Systems Announces $8.9M in Solar Orders
(December 17, 2007) TEMPE, AZ —Amtech Systems Inc., a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and silicon wafers, today announced that its subsidiary, Tempress Systems Inc., has received an additional $8.9 million in orders for diffusion processing systems from the solar cell industry.
From The Editor
Professional Enrichment
As an editor, I attend a good number of conferences and symposiums about advanced packaging technologies to gather information that is interesting to you, our reader. It is my job to educate and pass along what I've learned, so that you can expand your knowledge in areas of the industry you might not know a lot about. I sit with the other attendees, mostly engineers, and concentrate hard to make sense of what's being said.
PAGE:
1 | 2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
10 |
11 |
12 |
13 |
14 |
15 |
16 |
17 |
18 |
19 |
20 |
21 |
22 |
23 |
24 |
25 |
26 |
27 |
28 |
29 |
30 |
31 |
32 |
33 |
34 |
35 |
36 |
37 |
38 |
39 |
40 |
41 |
42 |
43 |
44 |
45 |
46 |
47 |
48 |
49 |
50 |
51 |
52 |
53 |
54 |
55 |
|
|
|
|
Search Articles
Advanced Search
|
Web Exclusives 