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New Products 2006 P1
Gold Alloy Bonding Wire
The alloy composition of TOUGHBOND series bonding wire ranges from 99 – 99.9% pure gold. Compared to 4N and Au/Pd alloy wires, the series reportedly shows improved gold-to-aluminum ball-bond reliability and is less likely to corrode after aging at a high temperature.
Motorized Take-up System
A motorized take-up option gathers the protective liner from dicing tape operating on wafer mounters. The system gathers the liner into a disposable core.
Portable In-circuit Emulator
Measuring 120 × 100 × 30 mm, the RTE870/C Light Emulator comprises a 60-Kbyte emulation memory, interfaces for an MCU probe and host-connection, and other functions.
Inspection Tool
The IBIS-lab solder bump inspection equipment complements the IBIS in laboratory development or small-scale prototyping. Manually operated, the system offers process control software targeting solder bump metrology, true white light interferometry, and massively parallel digital signal processing.
UV Curing Lamp
With high intensity and a longer bulb life, the BlueWave 50 AS UV spot-curing lamp cures adhesives, coatings, and encapsulants. It emits more than 3,000 mW/cm2 of primarily UVA and blue visible light.
Parametric Test Option
The N9201A array structure parametric test option for 4070 systems provide support for up to 40 source/monitor unit (SMU) architectures. The SMU capacity improves characterization speeds for in-line array test structures in back-end-of-line (BEOL) tests.
Encapsulant
The Plaskon Colormold SD-8001 mold compound differentiates products for the memory card market. This epoxy mold compound, in black, red, blue, and more, offers color and fashion to distinguish products without detrimental effects on mechanical performance or cost requirements.
Sensor/Camera Chip
The OV77230 targets security and surveillance applications. The high-sensitivity, low-power digital video graphic array (VGA) camera chip sensor produces quality digital output.
Convertible Wire Bonder
The Model 4700 convertible wire bonder, with analog dials and a special transducer, performs wedge or capillary mounting. Changeover is accomplished by swinging the assembly into position for ball or wedge bonding and loading wire.
Lead-free Die-attach Adhesive
The MicrobondGecko die-attach adhesive for lead-free applications bonds die-attach connections to power components without soldering to a leadframe. The adhesive series can be tested and processed in the same way as high-lead solders.
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