Web Exclusive Articles
New Products |
Industry News |
Archives Home
Industry News 2006 P24
IDTechEx Predicts Active RFID Growth
(July 21, 2006) CAMBRIDGE, UK — Active radio frequency identification (RFID) systems will experience a rapid market growth over the next 10 years, according to a forecast by IDTechEx. From the 2006 market value of $550 million, active RFIDs will increase market value to $6.78B in 2016. The report, titled "Active RFID 1006-2016," identifies four major contributing factors and two important markets that will create the upward trend.
Wireless Chip Links Physical to Digital
(July 20, 2006) PALO ALTO, CA — HP Labs announced the development of a miniature, wireless data chip that embeds digital information into paper, pharmaceutical containers, and other physical objects. The self-contained, RoHS-compliant prototype chip is based on a standard CMOS, with a built-in antenna; according to HP, no special materials are used in fabrication.
Illinois Tool Works Inc. Buys Kester
(July 20, 2006) DES PLAINES, IL — Illinois Tool Works Inc. of Glenview, IL, acquired all the shares of Kester, a Des Plaines, IL-based solder supply company. Kester will adopt ITW's 80/20 design and manufacturing methodologies and corporate infrastructure due to the purchase.
FocalSpot Re-enters Packaging Test
(July 18, 2006) SAN FRANCISCO — FocalSpot, an inspection and rework company for ball grid arrays (BGAs) and SMT, announced they will re-enter the semiconductor and microelectronics industry with a product rollout targeting packaging test.
Foundries Entering Packaging Game
(July 19, 2006) SINGAPORE — Chartered Semiconductor and Singapore's Agency for Science, Technology, and Research formed a partnership to develop advanced fine-pitch packaging technology, after considering the possibilities for volume ramp with a proprietary backend packaging strategy.
Thoughts on the News
Miniaturization Update at Tessera's Symposium
Vertical integration was the focus at Tessera's annual "Electronic Product Miniaturization Symposium," held July 10 during SEMICON West in San Francisco. The half-day event drew about 150 people with speakers from Prismark Partners, Cadence Design Systems, Samsung, Intel, Hewlett Packard, and Motorola.
SEMICON West Wrap-up
The emerging technologies TechXPOT stage drew crowds to the third floor of West Hall, giving those exhibitors better exposure than last year. Analyst Jean Christophe Eloy from Yole Développement kicked off the MEMS session noting that packaging comprises 40 % of the MEMS equipment market. Wafer-level packaging (WLP) is driving growth in both silicon and glass substrates, and 70% of today's pressure sensors use WLP.
From the Editor
The SEMICON West Experience
That was great, don't you think? Attending SEMICON West for the first time was sort of like being an exchange student for a week. What better way to learn than through total immersion in the industry? I got to spend time with people who had such enthusiasm about their products and technologies, and took the time to explain it all.
AC Awards Celebrate SEMICON Products
(July 17, 2006) SAN FRANCISCO — Advanced Packaging and Solid State Technology Magazines invited SEMICON West attendees to vote for Final Manufacturing and Wafer Processing products that demonstrated capabilities for the next generation in the industry. Winners received Attendees' Choice Awards in categories based on viability, innovation, and adaptability.
Prediction: 11.6% Growth in Packaging Investments
(July 17, 2006) SAN FRANCISCO — The 2006 semiconductor equipment market is expected to grow 18% in 2006, with the Chinese market region leading the trend, according to SEMI's Mid-year Consensus Forecast. Respondents surveyed saw a flat market approaching in 2007, with 2008 reviving growth to 18%.
PAGE:
1 |
2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
10 |
11 |
12 |
13 |
14 |
15 |
16 |
17 |
18 |
19 |
20 |
21 |
22 |
23 |
24 | 25 |
26 |
27 |
28 |
29 |
30 |
31 |
32 |
33 |
34 |
35 |
36 |
37 |
38 |
39 |
40 |
41 |
|
|
|
|
Search Articles
Advanced Search
|
Web Exclusives 