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Industry News 2006 P15
From the Editor
Back to School
Remember the good old days when the back-to-school shopping list included pens, pencils, crayons, a protractor, notebooks, and a lunchbox? This year, the list for my 7th grade twins included USB flash drives and a very sophisticated calculator, which would reportedly carry the kids through high school. While as a mom, this didn't have me dancing all the way to Staples, as an editor of Advanced Packaging Magazine, I think it's pretty encouraging news.
Dialog Semiconductor Restructures
(September 19, 2006) STUTTGART, Germany — Dialog Semiconductor PLC will transfer its final-stage production test operations from Kirchheim/Teck-Nabern, Germany, to manufacturing test service providers in Asia. Adverse trading conditions persisting throughout 2006, as well as a tri-part restructuring model, formed Dialog's decision.
SMTAI Panel Investigates Packaging Potential
(September 20, 2006) NASHUA, N.H. — The mantra of smaller, faster, cheaper has never been so relevant as in today's advanced packaging area. University professors, OEMs, and contract assemblers (EMS providers) will discuss packaging methods in a lively and informative panel hosted by SMT Magazine at SMTA International. "Future Directions in Packaging," will conclude with questions for and from the audience, and copies of the presentations.
RoHS Report Excludes Comparisons
By George A. Riley, contributing editor
A European Union (EU) Commission for Environment report on scientific and technical progress in implementing RoHS declined to consider a U.S. Environmental Protection Agency (EPA) study showing that some lead-free solders may damage the environment more than the tin-lead solders they replace. The July 28, 2006 final report concluded that comparisons of no-lead solders to tin-lead were outside the scope of this scientific review.
AP Interview:
Researcher Explores Printable Nano-materials
By Meredith Courtemanche, assistant editor
Printed nano-materials present electronics designers with the potential for small, flexible, light-weight, and inexpensive devices beyond silicon. Conductive nano-materials are printed with familiar techniques, comparable to those used to press newspapers. Ashok Maliakal is a researcher for flexible, printed ICs at Bell Labs, the R&D center for Lucent Technologies. He talked to AP about the usefulness of plastic, moldable ICs.
Synova Opens Boston MMC
(September 18, 2006) LAUSANNE, Switzerland — Synova will open a micromachining center (MMC) in Boston, MA. For a full explanation of Synova's MMC expansion, see our interview with Bernold Richerzhagen, CEO. Synova will use the facility for demonstrations, sample tests, and application development.
3-D Options on the Table at Napa Workshop
By Jeffrey C. Demmin, contributing editor
The 2006 KGD Packaging & Test Workshop, held in Napa September 10 – 13, gathered the usual excellent slate of speakers at the 13th annual installment of the popular event. The location and extracurricular activities were a nice bonus for attendees, but the real draw was the program, with talks from industry leaders representing Micron, Samsung, Infineon, SPIL, STATS ChipPAC, Nokia, and many others.
Private Holders Acquire Freescale
(September 18, 2006) AUSTIN, TX — Freescale Semiconductor, Inc., has entered into a definitive merger agreement with a private equity consortium. The group plans to acquire Freescale at a total equity value of $17.6B. The merger is led by Blackstone Group, Carlyle Group, Permira, and Texas Pacific Group.
MOEMS Market Geared Toward End-users
(September 15, 2006) DUBLIN, Ireland — Research and Markets has released a report, "MEMS4Display 06: Market Analysis of MEMS-based Microdisplays," which reveals that consumer interests will control the application of MEMS in display technology. Branding, portability, reliability, and picture quality will determine growth in the MEMS display sector.
AAA Names Reps
(September 14, 2006) SAN DIEGO — CAPLINQ Nederland became Advanced Applied Adhesives' (AAA's) representative in the Middle East, North Africa (MENA), and Europe, replacing the now-defunct Norel. Located in Amsterdam, the Netherlands, CAPLINQ was founded by Christopher Perabo, who previously held a field applications engineer post with Henkel's Semiconductor Materials division.
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