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Industry News 2006 P1
Egide Signs U.S. Contract with Textron Systems
(December 21, 2006) TRAPPES, France — Egide, a European group manufacturing of hermetic packages for sensitive electronic components, has signed an agreement to supply hermetic packages for Textron System's military Sensor Fuzed Weapon Program (SFW).
November Book-to-Bill Sees Slight Increase
(December 20, 2006) SAN JOSE, CA — North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.97 in November, up slightly from October's 0.95. Bookings averaged $1.45B and billings reached $1.49B.
BiTS 2007 Highlights Evolving Industry
(December 19, 2006) MESA, AZ — The 8th annual Burn-in and Test Socket (BiTS) Workshop — March 11 – 14, 2007 in the Hilton Phoenix East of Mesa, AZ — issued an advance program with details on tutorials, keynotes, and presentations. BiTS EXPO, which runs concurrent with the workshop, will host about 40 socket and related companies.
Wafer-probe Cleaner
Developed for IC chip manufacturing markets to address probe contamination challenges during test, the SnoScrub wafer-cleaning product uses non-contact CO2-composite spray for adjustable (soft-to-hard cryoparticles), microscopic scouring called cryochemical ablation. This technology cleans wafer probes and high-speed test sockets, removing resistive buildup such as aluminum oxides and human contaminants.
Parametric Test Software
The KTE V5.2 interactive test environment software is compatible with the series S600 parametric test system. The software is said to increase throughput for circuit-materials testing, including radio frequency (RF) materials. The KTE test environments suit wafer-level test development and execution.
From the Editor
Happy Holidays from Advanced Packaging
I hate to admit it, but holiday preparations are very distracting. All I can think about is remembering to go to Borders today so I can use the 40% off coupon for the Gilmore Girls' DVD boxed set. I still have stocking stuffers to buy and haven't even started wrapping presents yet. I completely gave up on sending Christmas cards this year, and where did I get the idea that I had time to take the kids to New York last weekend?
Amkor Licenses Lead-free Bumping to AMD
(December 20, 2006) CHANDLER, AZ — Amkor Technology, Inc., signed a licensing agreement for Advanced Micro Devices (AMD) to use its lead-free electroplated wafer-bumping technology. Terms remain undisclosed.
Organic Electronics Take Commercial Path
(December 19, 2006) GLEN ALLEN, VA — A report by NanoMarkets, LC, "Organic Electronics: A Market and Technology Assessment," predicts the market for organic LEDs (OLEDs), transistors, and other organic-material electronics to reach $34.4B in 2014. The research firm cites several trends in the organic-electronics industry as indicators of commercialization.
Tessera's Latest Technology Expands Portfolio
By Françoise von Trapp, managing editor
(December 20, 2006) SAN JOSE, CA — In a continued effort to expand product offerings and offer a complete suite of technologies leveraged across the image sensor and optical device market, Tessera Technologies, Inc., introduced SHELLCASE RT. With a profile of 500 µm — RT stands for razor-thin — the technology is claimed to be one of the thinnest wafer-level chip-scale packaging (WLCSP) technologies.
AWR, DuPont Pool Process-design Resources
(December 18, 2006) EL SEGUNDO, CA and RESEARCH TRIANGLE PARK, NC — Applied Wave Research, Inc., (AWR) and DuPont Microcircuit Materials of DuPont Electronic Technologies created a process design kit (PDK) that enables radio-frequency (RF), microwave, and millimeter-wave designers to access DuPont's GreenTape low-temperature co-fired ceramic (LTCC) technology within AWR's Microwave Office 2006 software.
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