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Industry News 2005 P1
Speedprint Offers Novatec Tool to Enhance Printing Platform
DORSET, UNITED KINGDOM — Through an OEM supply agreement, Speedprint Technology Ltd., a division of Blakell Europlacer Group, will offer Novatec's VacuNest Shape Memory Tool solution on its printer platforms.
THOUGHTS ON THE NEWS
Worldwide Semiconductor Sales Surpass '00 Record
News Analysis by Julia Goldstein, Ph.D., Advanced Packaging technical editor
Gartner Dataquest announced revenue results for 2005 at their December 6 Semiconductor Industry Briefing. Worldwide semiconductor revenue will total $235 billion in 2005, surpassing the record set in 2000 for the first time.
(December 20, 2005)
AMIS, Mentor Graphics Team Up in Mixed-signal TDK
Pocatello, ID — AMI Semiconductor (AMIS) and Mentor Graphics are partnering with the development of an analog/mixed-signal technology design kit (TDK) containing comprehensive and proven building blocks at the device level. This kit enables semiconductor companies and electronic systems manufacturers to kick off their design cycles on AMIS's foundry process using Mentor's analog/mixed-signal IC flow.
FROM THE EDITOR
Nashua, NH — With only 4 more shopping days until Christmas, the sense of urgency to get it done, no matter what the cost, begins to overshadow the meaning of the season. The same could be said as the deadline for RoHS approaches.
IEEE Approves Standard for System-level Chip Design
Piscataway, NJ — The IEEE has approved a new electronic design standard for the SystemC 2.1 language, titled "Standard SystemC Language Reference Manual." The standard addresses the increasing complexity of system-on-chip (SoC) design at the systems level.
Semitool Installs Third Single-wafer System at LETI
Kalispell, MT — Wafer processing equipment supplier Semitool, Inc. has installed its third Raider platform at the CEA Leti Nanotec (LETI) in Grenoble, France. This latest version of the Raider single-wafer system will allow LETI to develop and deploy 45- and 32-nm processes for copper-interconnect-related applications on 300-mm wafers using Semitool's latest ElectroChemical Deposition (ECD) system.
ChipMOS, Spansion Join Forces in Assembly and Testing Agreement
Hsinchu, Taiwan, and Sunnyvale, CA — ChipMOS Technologies Inc., a subsidiary of ChipMOS, has entered into an assembly and testing agreement with Spansion LLC, the Flash memory venture of Advanced Micro Devices, Inc. and Fujitsu Limited. ChipMOS Taiwan will become an outsource provider of assembly and testing services for Spansion under the terms of the agreement.
THOUGHTS ON THE NEWS
The Week in Packaging
News Analysis by Jeffrey C. Demmin, Advanced Packaging contributing editor
Recent headlines in the packaging world fall into every category — technology, expansion, personnel, collaboration, financial — and Intel has been part of several of those headlines.
(December 12, 2005)
Taiwan-based CMP Technologies Center Breaks Ground
Phoenix, AZ — Rohm and Haas Electronic Materials CMP Technologies' new Asia-Pacific Manufacturing and Technical Center at the Hsinchu Science Park, Chunan satellite campus in Taiwan is now open, adding to the company's growing business in Asia. Commercial production will begin by the first quarter of 2007.
Dow Corning Wins Frost & Sullivan Award
Midland, MI — Dow Corning Corp. has been named Specialty Chemicals Company of the Year by global market analysts Frost & Sullivan, who highlighted Dow Corning's ability to drive innovation, its customer solutions approach, success in geographic expansion, and exceptional financial results.
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