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Industry News 2004 P5
Tessera Announces First Annual SiP Symposium In Japan
(November 24, 2004) San Jose, Calif.—Building on its successful second annual Technology
Symposium held in San Jose, Calif. earlier this year, Tessera Technologies announces that it will take the first annual SiP Symposium to Tokyo, Japan.
TSMC Releases 40-V CMOS Process
(November 24, 2004) Hsinchu, Taiwan—Taiwan Semiconductor Manufacturing Co. (TSMC) announces that volume production is available for its 0.18-micron process technology with 40-V capability. The high-voltage process will allow designers to produce single-chip TFT LCD drivers for portable applications that reduce chip count and save space and power.
North American Semiconductor Equipment Industry Posts October 2004 Book-to-Bill Ratio
(November 23, 2004) San Jose, Calif.—North American-based manufacturers of semiconductor equipment posted $1.39 billion in orders in October 2004 (three-month average basis) and a book-to-bill ratio of 0.96, according to the October 2004 Book-to-Bill Report published by SEMI. A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.
SEMI Announces Technology Innovation Showcase
(November 23, 2004) San Jose, Calif.—SEMI has announced a "call for innovations" for the third annual Technology Innovation Showcase, to be held in conjunction with SEMICON West 2005. The application deadline is February 6, 2005.
Amkor Partners with Sigrity on SoC Packaging Template Library
(November 19, 2004) Chandler, Ariz.—Amkor Technology announces that it is working with EDA tool provider, Sigrity Inc. of Santa Clara, Calif., to develop a package-design template library that will be incorporated into Sigrity's EDA tools. The library will address flip chip and high-end wire bond packages for SoC applications.
Kulicke & Soffa Reports Revenue Down 24%, Bonder Sales Plunging 49%
(November 18, 2004) Willow Grove, Pa.—Kulicke & Soffa recorded net income of $29.1 million in the March quarter and $22.7 million in the June quarter, but now it's back to lean times. Reported net income of $3.3 million or $0.05 per fully diluted share on net revenues of $147.5 million for the quarter ended September 30, 2004.
ADI Rolls Out TD-SCDMA Communications Chipset
(November 17, 2004) Taipei, Taiwan—U.S. chipmaker Analog Devices Inc. (ADI) is introducing a chipset for China's nascent 3G mobile communications standard.
ChipMOS Appoints New Director
(November 16, 2004) Hsinchu, Taiwan—ChipMOS Technologies Ltd. announces that Mr. Jerome Chao-Jung Tsai was appointed to the company's Board of Directors, replacing Mr. Min-Liang Chen, who resigned due to time constraints.
FROM THE EDITOR
(November 16, 2004) Nashua, N.H.—What's the latest in Advanced Packaging? There's quite a lot happening in lead-free initiatives. For instance, Technology Forecasters and Phoenix-based Avnet Inc. conducted a survey of component suppliers and found that 94% of respondents indicated that they are designing components compliant with RoHS regulations. Yet only 53% indicate they intend to ascribe new part numbers to their lead-free components.
THOUGHTS ON THE NEWS
European Equipment Moves
News Analysis by Jeffrey C. Demmin, Advanced Packaging contributing editor
It was a surprise to me when Datacon announced that it will be bought by BE Semiconductor Industries, but the move does make some sense.(November 16, 2004)
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