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Industry News 2004 P33
SEMI posts January book-to-bill ratio of 1.18
(February 20, 2004) San Jose, Calif.—North American-based manufacturers of semiconductor equipment posted $1.22 billion in orders in January 2004, according to SEMI, and a book-to-bill ratio of 1.18.
SEMI's 'Test and Packaging 2004 and Beyond' forum reveals packaging trends
(February 16, 2004) San Jose, Calif.—During SEMI's 'Test and Packaging: 2004 and Beyond' lunch forum, held February 12, several interesting trends were noted: unit shipments of IC packages and materials have reached historically high levels; wire bond pitches are nearing their theoretical limit; and alternative business models may be required to cope with the high cost of IC test.
THOUGHTS ON THE NEWS
Upgrading Semiconductor Assembly and Test Services
News Analysis by Jeffrey C. Demmin, Advanced Packaging contributing editor
We've seen some major corporate news recently among assembly and test companies, and, as if on cue, MEPTEC just announced its first "Interconnections Investors Conference," an event to give the subcontractors more visibility in the investment community.
(February 17, 2004)
Manipulating platinum at the nanoscale
(February 13, 2004) Albuquerque, NM—Researchers from the U.S. Department of Energy's Sandia National Laboratories and the University of New Mexico have developed a new way of mimicking photosynthetic proteins to manipulate platinum at the nanoscale. The method has the potential of changing the metal's properties and benefiting emerging technologies.
Amkor acquires Taiwan assembly and test facility
(February 13, 2004) Chandler, Ariz.—Amkor Technology Inc. has entered into an asset purchase agreement to acquire a 354,000-sq.-ft. assembly and test facility in Taiwan's Hsinchu Industrial Park from FICTA Technology Inc. This acquisition more than doubles Amkor's potential manufacturing footprint in Taiwan.
Kulicke & Soffa, ASE team up
(February 12, 2004) Willow Grove, Penn.—Kulicke & Soffa and ASE have formed a strategic relationship between Kulicke & Soffa's Test Products Group and ASE Test Limited. As part of the agreement, K&S will provide onsite services at ASE Test's facilities in Taiwan.
FSA says fabless funding increased in 2003
(February 11, 2004) San Jose, Calif.—The Fabless Semiconductor Association (FSA) announced that the amount of funding raised by fabless companies increased sequentially 23 percent quarter-over-quarter (QoQ) in Q4 2003.
K&S sells advanced packaging segment
(February 10, 2004) Willow Grove, Penn.—Kulicke & Soffa Industries Inc. has sold all the assets associated with its advanced packaging technology segment, which consisted solely of the flip chip business.
ChipPac, STATS plan merger
(February 10, 2004) Singapore and Fremont, Calif.—STATS and ChipPAC have signed a definitive agreement to merge in a stock-for-stock transaction that will result in an independent semiconductor assembly and test solutions company that is one of the larger test houses in the world.
SEMI publishes 25 new standards
(February 5, 2004) San Jose, Calif.—SEMI has published 25 new technical standards applicable to the semiconductor and flat panel display manufacturing industries.
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