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Industry News 2004 P29
Key to robust IC market is to avoid inflating prices, study says
(April 14, 2004) Saratoga,Calif.—Growth in worldwide IC revenues is being driven primarily by increased demand for IC units, as opposed to rising ASP — a positive sign indicating this boom isn't over yet, according to Advanced Forecasting, a quantitative semiconductor forecasting house.
STATS expands die stacking to exposed pad leadframe-based packages
(April 14, 2004) Milpitas, Calif.—ST Assembly Test Services Ltd. (STATS) has expanded its die stacking technologies to exposed pad leadframe-based packages to enable higher thermal performance and cost-effective solutions for consumer, communications, wireless handheld and portable consumer applications.
National Semiconductor going 'green'
(April 8, 2004) Santa Clara, Calif.—National Semiconductor has announced plans to offer lead-free packages for its complete line of IC products by the end of the year. The company also plans to significantly reduce bromine- and antimony-based flame retardants in an effort to make more environmentally neutral electronic components.
ASAT, Hong Kong Science and Technology Parks Corp. form alliance
(April 8, 2004) Pleasanton, Calif. —ASAT Holdings Ltd., a provider of semiconductor package design, assembly and test services, and the Hong Kong Science and Technology Parks Corp. (HKSTP) have formed an alliance to cooperatively promote IC packaging and test related services in Hong Kong and China.
Intel gets the lead out
(April 7, 2004) Santa Clara, Calif.—Intel Corp. is planning to eliminate approximately 95 percent of the lead used in its processors and chipsets, starting later this year. The company reports that it is taking these significant steps to remove lead from its product packaging to make it more environmentally friendly.
ChipPAC Korea achieves ISO/TS16949 certification
(April 5, 2004) Fremont, Calif.—ChipPAC Inc.'s Korea facility has achieved the International Standardization Organization's ISO/TS16949:2002 certification. ChipPAC Korea successfully passed a certification audit conducted by Lloyd's Register Quality Assurance (LRQA). LRQA is one of the world's foremost quality management systems certification bodies.
SIA says chip sales are up
(April 5, 2004) San Jose, Calif.—Worldwide sales of semiconductors in February 2004 rose 30.8 percent, reports the Semiconductor Industry Association (SIA), compared to February 2003. While total sales of $15.58 billion reflect a modest 0.2 percent increase from January 2004, the SIA noted that February historically has been a relatively weak month for chip sales.
THOUGHTS ON THE NEWS
Tin whisker debate continues
News Analysis by Julia Goldstein, Advanced Packaging technical editor
An important aspect of the transition to lead-free manufacturing is finishes on lead frames and component terminations. The industry is focusing on matte tin as a substitute for 90Sn10Pb, but the problem of tin whiskers continues to plague coatings. (April 1, 2004)
Amkor's Bird named chair of JEDEC Mechanical Standardization Committee
(April 1, 2004) Chandler, Ariz.—Amkor Technology Inc.'s James "Mark" Bird, technology fellow and senior director of Technical Marketing, has been elected chair of JEDEC's Mechanical (Package Outlines) Standardization Committee, JC-11. This committee covers mechanical standardization of a broad range of packaging formats.
Penn State researchers creating tiny lubricants for MEMS
(April 1, 2004) University Park, Penn.—Tiny machines built as part of silicon chips are all around us, and their need for lubrication is the same as large machines such as automobile engines, but conventional lubricants, like oils, are too heavy for these microelectromechanical systems (MEMS), so Penn State researchers are looking to gases to provide thin films of slippery coating.
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