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Industry News 2004 P24
August Technology Announces Multiple Orders from Leading Chinese Wafer Foundry
(June 17, 2004) Minneapolis — August Technology Corp. has received multiple orders from a leading Chinese foundry.
Honeywell Announces Price Increase for Electronic Chemicals Products
(June 16, 2004) Sunnyvale, Calif. — Honeywell announces that the company will be implementing price increases between 4 to 14 percent for part of its Electronic Chemicals product line.
Kester, Flip Chip International Collaborate on Development of New Wafer Bumping Solder Paste
(June 14, 2004) Des Plaines, Ill. and Phoenix — In a joint collaboration, Kester and FlipChip International (FCI) have worked side by side to introduce SE-CURE 7501, a low void wafer bumping solder paste formula designed for FCI's proprietary wafer bumping application.
IEEE CPMT Society announces '04 award winners
(June 15, 2004) Piscataway, N.J.—The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society recently announced its 2004 award recipients, recognizing them for their distinguished performance in their individual fields and for their dedication to the Society.
THOUGHTS ON THE NEWS
Sorting Out the Flip Chip Business
News Analysis by Jeffrey C. Demmin, Advanced Packaging contributing editor
Nestled between ECTC and SEMICON West on the calendar is the annual IMAPS flip chip workshop, which is being held June 21-24 in Austin, Texas this year.(June 14, 2004)
Revised SIA forecast for '04 may hurt semi equipment sales
(June 11, 2004) New Tripoli, Pa.—The SIA forecast that revised semiconductor growth from 19% and 6% growth in '04 and '05, respectively, to 29% and 4%, should negatively impact equipment sales for 2004, according to a report recently published by The Information Network, a New Tripoli, Pa.-based market research company.
Rohm and Haas Electronic Materials opens manufacturing facility in China
(June 9, 2004) Dongguan, China—Rohm and Haas Electronic Materials recently inaugurated its manufacturing facility in Dongguan, China. With annual sales of more than $1 billion, Rohm and Haas Electronic Materials delivers innovative material solutions for the electronic, optoelectronic and surface finishing industries.
ChipPAC's Malaysia facility achieves ISO/TS16949 certification
(June 9, 2004) Fremont, Calif.—ChipPAC Inc.'s Malaysia facility has achieved the certification status for ISO/TS16949:2002, after successfully passing a certification audit conducted by TUV Rheinland.
Allan Calamoneri named VP of Carsem's Test Business Development
(June 8, 2004) Scotts Valley, Calif.—Carsem, a provider of turnkey packaging and test services, announced that Allan Calamoneri has joined the company as the new vice president of its Test Business Development.
TI appoints Julie England as general manager of its RFID Systems Group
(June 8, 2004) Dallas, Texas—Julie England has been named general manager of Texas Instruments' radio frequency identification (RFID) Systems group, a business unit of Texas Instruments Sensors & Controls Division. Previously, she was a general manager of TI's Sun business within the Semiconductor group and has been a TI vice president since 1994.
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