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Industry News 2004 P20
Andigilog welcomes new vice president of engineering
(BUSINESS WIRE, July 29, 2004) Chandler, Ariz.—Andigilog, a fabless analog and mixed-signal semiconductor provider, announced today that Dr. David Cave has joined the company as its vice president of engineering. Cave, a 35-year veteran of the analog and mixed-signal semiconductor industry, spent 33 years at Motorola, most recently as vice president and director of Motorola Semiconductor Research Europe, where he directed research in China, Western Europe and the former Soviet Union.
Asyst CFO to step down
(ELECTRONIC NEWS, July 28, 2004) Fremont, Calif.—Asyst Technologies Inc., supplier of semiconductor manufacturing equipment, announced that its vice president and CFO David White will step down. The company states that the move is not in response to Asyst's lower-than-forecasted revenues for the first quarter (Q1) of 2004.
Fabless funding on the rise in 2004
(July 27, 2004) San Jose, Calif.—The Fabless Semiconductor Association (FSA) recently announced that fabless company funding sequentially increased 62 percent year-over-year (YoY) in Q2 2004. FSA made this announcement with the release of its Q2 2004 Fabless Fundings report. Forty-five fabless companies generated $543.7 million in investments in Q2 2004, compared to 27 in Q2 2003, totaling $335.4 million.
NEW PRODUCT
Semiconductor epoxy mold compound
(July 27, 2004—City of Industry, Calif.)
Henkel Technologies' latest packaging product, Hysol GR9810, is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate-based molded array packages, including SIP and flip-chip array packages that have been conventionally underfilled.
IMAPs names new executive director
(July 26, 2004) Washington, D.C.—IMAPs has chosen Michael O'Donoghue to replace Richard M. Breck as its executive director, effective September 1, 2004.
Americans hold favorable view of nanotechnology, survey shows
(SAN JOSE BUSINESS JOURNAL, July 26, 2004) Raleigh, N.C.—Americans generally view nanotechnology in a positive light, although they admittedly know little to nothing about this emerging science, according to a recent survey conducted by North Carolina State University researchers.
THOUGHTS ON THE NEWS
Surviving SEMICON West
News Analysis by Jeffrey C. Demmin, Advanced Packaging contributing editor
If you are reading this, that means that you have survived yet another SEMICON West. What did you think about it?
(July 26, 2004)
Henkel to market products under single corporate identity
(July 23, 2004) City of Industry, Calif.—Henkel Technologies today announced an initiative to market its products under a single, comprehensive banner and distance itself from its competition. The move will enable Henkel to drive increased visibility of its well-known Hysol, Loctite and Multicore advanced technology products and services.
NEW PRODUCT
High throughput backside wafer coating process
(BUSINESS WIRE, July 23, 2004—Cardiff, U.K.)
DEK has developed a high throughput backside wafer coating process that's hosted on a cost-effective mass imaging platform and capable of exceeding the ±12.5 µm total thickness variation required by most wafer processing specialists.
Altera to use Shin-Etsu's thermal interface gel in 90-nm FPGAs
(July 22, 2004) Phoenix, Ariz.—Tokyo-based Shin-Etsu Chemical Co., Ltd. announced today that Altera Corporation will use its thermally conductive interface gel material in the packaging of its high-end Stratix II FPGA family. Shin-Etsu's thermally conductive gel enables rapid heat transfer from IC packages and facilitates the dissipation of the heat generated during operations.
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