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Industry News 2004 P18
LogicVision provides UMC customers with enhanced wafer yield solution
(August 16, 2004) San Jose, Calif.—LogicVision, Inc., a provider of embedded yield enhancement solutions for integrated circuits, announced today that it has aligned with UMC to provide the foundry's customers with access to its wafer yield solution. This LogicVision product aims to develop increasingly higher wafer yields at 90 nm and below process geometries.
Major advance in gallium nitride nanowires
(August 13, 2004) Berkeley, Calif.— Scientists with the U.S. Department of Energy's Lawrence Berkeley National Laboratory and the University of California at Berkeley have made a significant advance in the development of gallium nitride. They have been able control the direction in which a gallium nitride nanowire grows. Growth direction is critical to determining the wire's electrical and thermal conductivity and other important properties.
Global chip equipment sales rise 46.2%
(August 11, 2004) Tokyo, Japan—Global sales of chip-making equipment rose 46.2 percent in June compared with May to $3.75 billion, helped by a sharp rise in sales in Taiwan and China, the Semiconductor Equipment Association of Japan reported Wednesday. The June figure was up 106.7 percent from a year earlier, marking it the eleventh straight month of year-on-year rises.
SiGen makes breakthrough in strained silicon technology
(August 12, 2004) San Jose, Calif.—Silicon Genesis Corporation (SiGen) announced today that it has developed a new wafer-level uniaxial strained substrate technology.
STATS ChipPAC Malaysia predicts 20-30% rise in revenue
(August 11, 2004) Kuala Lumpur, Malaysia—STATS ChipPAC Malaysia, a semiconductor test and assembly company, expects revenue to increase between 30 and 40% this year, after having invested an additional RM200 million to its support expansion and technological enhancements. The company's president and managing director, J.A. Lew, says the expansion involved upgrading the plant in terms of capacity, infrastructure and installing state-of-the-art equipment.
New process prints silicon on plastic
(August 9, 2004) Urbana, Ill.—Many research groups today work to improve the electrical capabilities of organic, or plastic, materials. But researchers from the University of Illinois at Urbana-Champaign are finding ways to produce extremely small electrical components from crystalline silicon that can be attached to a plastic backing.
It's official: STATS and ChipPAC complete merger
(August 5, 2004) Singapore—ST Assembly Test Services Ltd. and ChipPAC Inc. announced today the successful completion of their previously announced merger. As a result of the merger, the name of the new company is STATS ChipPAC Ltd. ChipPAC will continue operations as a wholly owned subsidiary of STATS ChipPAC Ltd.
Freescale Semiconductor wins 'First-Year Global Supplier' award
(August 5, 2004) Austin, Texas—Freescale Semiconductor, Inc. won a First-Year Partners in Performance award by Celestica, a leading electronics manufacturing services provider, for its contribution to the company in 2003.
ATS receives $10.7 million in orders from one of the world's largest medical device companies
(August 5, 2004) Cambridge, Ontario—ATS Automation Tooling Systems Inc. announced it has received a total of US $10.7 million in orders from one of the world's largest manufacturers of self-use medical diagnostic systems. This brings the value of orders for automation systems ATS has won over the past year from this particular customer to more than US $21 million.
New physics law unifies several superconducting compounds
(August 4, 2004) Upton, N.Y.—A research group led by a scientist at the U.S. Department of Energy's Brookhaven National Laboratory has discovered a simple relationship that mathematically links the properties of a class of high-temperature superconductors, materials that, below a certain temperature, conduct electricity with no resistance.
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