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Industry News 2004 P15
STATS ChipPAC Ltd. announces tender offer and consent solicitation
(September 7, 2004) Singapore and Fremont, Calif.—STATS ChipPAC Ltd. announced that, on September 3, 2004, its indirect wholly owned subsidiary ChipPAC International Company Limited commenced a cash tender offer relating to any and all of ChipPAC International's outstanding $165,000,000 aggregate principal amount of 12 3/4 percent Senior Subordinated Notes due 2009.
Sales of vacuum components and equipment sub-systems reached $2.6 billion in 2003
(September 3, 2004) San Jose, Calif.—The Working Group of the International Statistics on Vacuum Technology (ISVT) announced that global vacuum components and equipment sub-systems sales totaled $2.6 billion in 2003. The largest vacuum component market segment is semiconductor process vacuum with 38 percent.
Global semiconductor sales rose to $18 billion in July
(September 3, 2004) San Jose, Calif.—The Semiconductor Industry Association (SIA) reported this week that worldwide sales of semiconductors rose to $18.0 billion for the month of July. Although this number is below forecasted sales of $18.2 billion, it represents an increase of 37.9 percent from the $13 billion reported in July 2003.
IPC lowers prices on standards in electronic format
(September 1, 2004) Northbrook, Ill.—IPC—Association Connecting Electronics Industries has lowered prices on single-user standards and specifications purchased on CD or through electronic download. The company made this move to increase the demand and accessibility of its standards.
Tessera raises its financial guidance for Q3 and full year 2004
(September 2, 2004) San Jose, Calif.—Tessera Technologies, Inc., recently announced that it will raise its financial guidance for the third quarter and full year 2004. The company has increased its projected third quarter 2004 total revenue by approximately $2 million, which will also be incremental to its projected full year total revenue. Tessera now expects third quarter 2004 total revenues in the range of $22.3 to $22.6 million.
Pac Tech USA names new president
(August 31, 2004) San Jose, Calif.—Pac Tech GmbH, a German supplier of services, equipment and chemicals for semiconductor wafer bumping, has appointed Thorsten Teutsch, Ph.D., as president of its United States operation.
MEPTEC to host two luncheons in September
(August 30, 2004) Mountain View, Calif.—The Microelectronics Packaging and Test Engineering Council (MEPTEC) is gearing up to host two luncheons in September to unveil Dataquest's annual forecast. Jim Walker, VP of Semiconductor Manufacturing and Emerging Technologies at Gartner-Dataquest (and also a member of Advanced Packaging's advisory board), will present 'Up, Down, and All Around: Pedaling Your Way Through the Next Cycle.'
Novel way to make circuits at atomic scale
(August 30, 2004) Ithaca, N.Y.—Time is fast running out for the semiconductor industry as transistors become ever smaller and their insulating layers of silicon dioxide, already only atoms in thickness, reach maximum shrinkage. In addition, the thinner the silicon layer becomes, the greater the amount of chemical dopants that must be used to maintain electrical contact. And the limit here also is close to being reached.
Perfisans holdings gain 17.39% following announcement of new chip delivery to leading motherboard makers in Southeast Asia
(August 30, 2004) Los Angeles, Calif.—Perfisans Network Corp.'s holdings traded up 17.39% this past Friday on volume of 50,938—more than three times its average volume of 14,048—to close at $1.35, its high of the day.
Intel develops chip with 35 nm transistor switches
(August 30, 2004) San Jose, Calif.—Intel Corp. announced today that it has achieved a milestone in shrinking the size of transistors that will power its next-generation chips. Specifically, the company has created a fully functional 70-mb memory chip with transistor switches measuring just 35 nm—about 30% smaller than those found on today's state-of-the-art chips.
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